2008

Wafer Processing Solution

altSarnoff Corporation (Princeton, NJ) has introduced Ultra-SenseTM, a complete wafer processing solution. Ultra-Sense combines Silicon-on-Insulator (SOI) wafer technology with low-cost, scalable fabrication techniques to provide manufacturable back-illuminated image sensors. Ultra-Sense back-illuminated image sensors improve the performance and lower costs of high-resolution CCD or CMOS imaging systems for cell phone camera modules, digital still cameras, Ultraviolet (UV) and Deep UV, Visible, Near Infrared (NIR) inspection systems, spectroscopy systems, and surveillance systems.

For Free Info Visit http://info.hotims.com/15140-216

White Papers

Using Acoustic Beamforming for Pass-By Noise Source Detection
Sponsored by National Instruments
3D PRINTERS VS. 3D PRODUCTION SYSTEMS: 10 Distinguishing Factors to Help Select a System
Sponsored by Stratasys
An Introduction to LED Capabilities
Sponsored by Photo Research
How to Choose the Right Sensor for Your Measurement System
Sponsored by National Instruments
How to Maximize Temperature Measurement Accuracy
Sponsored by VTI Instruments
SpaceClaim in Manufacturing
Sponsored by SpaceClaim

White Papers Sponsored By: