2008

Ultra-Thin Silicon Solar Cells Process

altIMEC (Leuven, Belgium) has developed a new method to produce ~50μm thin crystalline silicon wafers for use in solar cells. The process involves mechanically initiating and propagating a crack parallel to the surface of a Si wafer. The method makes use of industrially available tools, such as a screen printer and belt furnace, and is potentially kerf-loss free. Adding an ultra-thin wafer or foil of active silicon on top of a low-cost substrate is a solution to reducing the amount of high-grade silicon used in solar cells.

For Free Info Visit http://info.hotims.com/15140-213

White Papers

SunWize Power Systems – Guidelines for Choosing the Right Product
Sponsored by SunWize
Working With Mechanical Motion Subsystems
Sponsored by Bell Everman
Unique Method for Orifice Production
Sponsored by Bird Precision
How to Avoid Bearing Corrosion
Sponsored by Kaydon
Antenna Basics
Sponsored by Rohde and Schwarz
Solar Electric Systems – Power Reliability
Sponsored by SunWize

White Papers Sponsored By: