Thermal Transport Model for Heat Sink Design
Tuesday, 01 December 2009
A document discusses the development
of a finite element model for
describing thermal transport through
microcalorimeter arrays in order to
assist in heat-sinking design. A fabricated
multiabsorber transition edge sensor
(PoST) was designed in order to reduce
device wiring density by a factor of four. The finite element model consists of
breaking the microcalorimeter array
into separate elements, including the
transition edge sensor (TES) and the
silicon substrate on which the sensor is
deposited. Each element is then broken
up into subelements, whose surface
area subtends 10 × 10 microns.
The heat capacity per unit temperature,
thermal conductance, and thermal
diffusivity of each subelement are
the model inputs, as are the temperatures
of each subelement. Numerical
integration using the Finite in Time
Centered in Space algorithm of the
thermal diffusion equation is then performed
in order to obtain a temporal
evolution of the subelement temperature.
Thermal transport across interfaces
is modeled using a thermal
boundary resistance obtained using
the acoustic mismatch model.
The document concludes with a discussion
of the PoST fabrication. PoSTs
are novel because they enable incident
x-ray position sensitivity with
good energy resolution and low wiring
This work was done by James A. Chervenak,
Richard L. Kelley, Ari D. Brown, Stephen J.
Smith, and Caroline A. Kilbourne of Goddard
Space Flight Center. For more information,
download the Technical Support Package
(free white paper) at www.techbriefs.com/tsp
under the Information Sciences category.
This Brief includes a Technical Support Package (TSP).
Thermal Transport Model for Heat Sink Design (reference GSC-15671-1) is currently available for download from the TSP library.
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