Low-Cost Liquid Metal Cooling for High-Thermal-Density Electronics

Liquid metal has been used as a coolant for system-level thermal management for decades in nuclear reactors. The reason is its efficiency — liquid metal can have an effective thermal conductivity 10 to 100 times the thermal conductivity of copper. However, cost and long-term reliability of liquid metal cooling approaches have previously precluded its widespread use for cooling of high-thermal-density electronics. Rockwell Collins has developed a liquid metal cooling technology that solves these issues.

It uses liquid metal in a substrate for locally cooling electronics components and carrying waste heat away to heat sinks. The liquid metal coolant (a compound of gallium, indium, and tin eutectic) is circulated using a solid-state pump. Because the substrates are simple and the cooling channels are very thin, this new approach requires very little liquid metal. This technology is more comparable to heat pipes and vapor chambers, but with gravity independence, mechanical flexibility, and tailorable thermal resistance.

Get the complete report on this technology at:
Email: This email address is being protected from spambots. You need JavaScript enabled to view it.
Phone: 781-972-0600

White Papers

Stencil-less Jet Printing for PCB Assembly
Sponsored by Imagineering
A Brief History of Modern Digital Shaker Controllers
Sponsored by Crystal Instruments
Critical Techniques for High-Speed A/D Converters in Real-Time Systems
Sponsored by Pentek
Avoiding Common Mistakes in Extractables/Leachables Program Design
Sponsored by Wuxi Apptec
Force Sensors For Design
Sponsored by Tekscan
Electropolishing for the Aerospace Industry
Sponsored by Able Electropolishing

White Papers Sponsored By:

The U.S. Government does not endorse any commercial product, process, or activity identified on this web site.