Low-Cost Liquid Metal Cooling for High-Thermal-Density Electronics

Liquid metal has been used as a coolant for system-level thermal management for decades in nuclear reactors. The reason is its efficiency — liquid metal can have an effective thermal conductivity 10 to 100 times the thermal conductivity of copper. However, cost and long-term reliability of liquid metal cooling approaches have previously precluded its widespread use for cooling of high-thermal-density electronics. Rockwell Collins has developed a liquid metal cooling technology that solves these issues.

It uses liquid metal in a substrate for locally cooling electronics components and carrying waste heat away to heat sinks. The liquid metal coolant (a compound of gallium, indium, and tin eutectic) is circulated using a solid-state pump. Because the substrates are simple and the cooling channels are very thin, this new approach requires very little liquid metal. This technology is more comparable to heat pipes and vapor chambers, but with gravity independence, mechanical flexibility, and tailorable thermal resistance.

Get the complete report on this technology at:
Email: This email address is being protected from spambots. You need JavaScript enabled to view it.
Phone: 781-972-0600

White Papers

Putting FPGAs to Work in Software Radio Systems
Sponsored by Pentek
How Lean Manufacturing Adds Value to PCB Production
Sponsored by Sunstone Circuits
Estimating the Effort and Cost of a DO-254 Program
Sponsored by Logic Circuit
Piezo Engineering Tutorial
Sponsored by aerotech
Envelope Tracking and Digital Pre-Distortion Test Solution for RF Amplifiers
Sponsored by Rohde and Schwarz A and D
Working With Mechanical Motion Subsystems
Sponsored by Bell Everman

White Papers Sponsored By: