2010

Avionics Reliability – Thermal Design Considerations

Please Login at the top
of the page to download.

Thermal design for reliability faces challenges from power dissipation demands from increased processing, sensing and communication requirements plus targets for size, weight and operation. Address thermal challenges effectively with electronics cooling simulation that brings electronic and mechanical design flows closer.

 

 

 

 

 

 

White Papers

3D Engineering: How 3D Direct Modeling Empowers Conceptual Engineering and Enables Simulation-Driven Product Development
Sponsored by SpaceClaim
Removing the Gap Between ECAD and MCAD Design
Sponsored by Mentor Graphics
OEM Optical System Development
Sponsored by Ocean Optics
The Basics Of Pressure Regulators
Sponsored by Beswick
Envelope Tracking and Digital Pre-Distortion Test Solution for RF Amplifiers
Sponsored by Rohde and Schwarz A and D
When Wire Feedthroughs Make Sense
Sponsored by Douglas Electrical Components

White Papers Sponsored By: