2010

altFEI (Hillsboro, OR) has introduced the Helios NanoLab™ x50 DualBeam™ Series, which integrates FEI's extreme high-resolution scanning electron microscope (XHR SEM) with a high-performance focused ion beam (FIB) to deliver imaging and milling capability. The Tomahawk FIB provides SEM and FIB live monitoring of milling operations, a smaller FIB spot for more precise milling control, as well as higher beam currents for faster material removal on large structures, such as through silicon vias (TSVs). The Helios 405(S) series is designed for semiconductor labs that require shrinking dimensions at sub-32 nm nodes and TEM imaging. The Helios 650 is designed for academic and industrial research centers that conduct advanced material characterization and modification down to the single nanometer scale.

For Free Info Visit http://info.hotims.com/28057-213

White Papers

Power Control For Automotive Applications
Sponsored by Maxim Integrated
Searching, Exploring and Visualizing Data Using Maple
Sponsored by Maplesoft
Key Considerations for Powertrain HIL Test
Sponsored by National Instruments
Evaluating Electrically Insulating Epoxies
Sponsored by Master Bond
Selecting the Right Material for 3D Printing
Sponsored by Proto Labs
Integrating Novel Materials to Improve Medical Device Performance
Sponsored by Pulse Technologies

White Papers Sponsored By:

The U.S. Government does not endorse any commercial product, process, or activity identified on this web site.