2010

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Olympus Integrated Technologies America, San Jose, CA, has released the Olympus IR 3D-IC Automated Metrology System, which provides IR microscopy and imaging technology to verify alignment of bonded wafers and through silicon vias (TSVs). The system observes and acquires images of alignment targets and vias by observing up to 1200 μm of bulk silicon to the patterned surfaces. Overlaid alignment marks are imaged and measured to verify bonding alignment accuracy.

For Free Info Visit http://info.hotims.com/28060-151

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