2010

BioNet Digital Communications Framework

BioNet v2 is a peer-to-peer middleware that enables digital communication devices to “talk” to each other. It provides a software development framework, standardized application, network-transparent device integration services, a flexible messaging model, and network communications for distributed applications. BioNet is an implementation of the Constellation Program Command, Control, Communications and Information (C3I) Interoperability specification, given in CxP 70022-01.

The system architecture provides the necessary infrastructure for the integration of heterogeneous wired and wireless sensing and control devices into a unified data system with a standardized application interface, providing plug-and-play operation for hardware and software systems.

BioNet v2 features a naming schema for mobility and coarse-grained localization information, data normalization within a network-transparent device driver framework, enabling of network communications to non-IP devices, and fine-grained application control of data subscription bandwidth usage. BioNet directly integrates Disruption Tolerant Networking (DTN) as a communications technology, enabling networked communications with assets that are only intermittently connected including orbiting relay satellites and planetary rover vehicles.

This work was done by Kevin Gifford, Sebastian Kuzminsky, and Shea Williams of the University of Colorado at Boulder for Glenn Research Center.

Inquiries concerning rights for the commercial use of this invention should be addressed to NASA Glenn Research Center, Innovative Partnerships Office, Attn: Steve Fedor, Mail Stop 4–8, 21000 Brookpark Road, Cleveland, Ohio 44135. Refer to LEW-18415-1

White Papers

Is There an Easy Way to Cut the Cost of EWIS Compliance?
Sponsored by Mentor Graphics
Guidelines for Ensuring PCB Manufacturability
Sponsored by Sunstone Circuits
Manager’s Guide to Productivity Gains With Multiphysics Simulation
Sponsored by COMSOL
3D Printing with FDM: How it Works
Sponsored by Stratasys
How Lean Manufacturing Adds Value to PCB Production
Sponsored by Sunstone Circuits
SpaceClaim in Manufacturing
Sponsored by SpaceClaim

White Papers Sponsored By: