2010
×

Warning

cleanMSGarbage - cleaned 2 Mso and mce styles

An organization seeks printing technologies to produce higher-current miniature circuitry. Approaches of interest include reducing use of expensive inks, eliminating a plating step, and increasing adhesion to a variety of substrates. An additional area of interest is to enable multilayer structures for more complex circuitry. The company would consider an alternate ink material that may have lower viscosity but can produce the trace thickness capable of handling sufficient current; higher silver loadings (on the order of 40-60%); or an inexpensive seed ink that could be electroplated (or used with electroless deposit), and then electroplated afterwards.

Respond to this TechNeed at:
www.techbriefs.com/tn/201005d.html
Email: This email address is being protected from spambots. You need JavaScript enabled to view it.
Phone: 781-972-0600

White Papers

The Economics of Accuracy in Low-cost, High-volume Sensing Applications
Sponsored by Honeywell
Using UV LEDs to Cure Fiber Optic Cables
Sponsored by Excelitas
The Ultimate Shaft-To-Hub Connection
Sponsored by Stoffel Polygon
2016’s Best Practices for NPI and NPD Success
Sponsored by Arena Solutions
Simulating Composite Structures
Sponsored by ANSYS
Software Defined Radio Handbook
Sponsored by Pentek

White Papers Sponsored By:

The U.S. Government does not endorse any commercial product, process, or activity identified on this web site.