Photovoltaic Metallization Paste
- Friday, 01 July 2011
DuPont Microcircuit Materials (MCM) (Research Triangle Park, NC) has introduced DuPont™ Solamet® PV701 photovoltaic metallization paste, a Metal Wrap Through (MWT) technology for back side interconnected silicon solar cell designs. The product composition specifically enables up to 0.4 percent greater efficiency in MWT cell designs versus standard cell designs. The specialized cell structure transfers the bus bars on the front side to the backside, reducing shading on the front side of the cell. The connections are made through holes in the silicon with the same composition as the bus bars. Employed as a via paste and p-contact metallization for back side tabbing interconnects, Solamet® PV701 features electrical contact to front side silver grid structures, high-mechanical strength, low shunting, high-line conductivity, and solderability as a p-contact metallization.
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