The Versa 3D™ DualBeam™ system from FEI Company (Hillsboro, OR) provides high-resolution, three-dimensional imaging on a range of sample types. Versa 3D is available with either high-vacuum-only or high- and low-vacuum electron imaging hardware. New features, such as FEI’s SmartSCAN™ and Drift Corrected Frame Integration (DCFI), facilitate electron beam imaging of sample types with a range of different properties. Advanced backscattered electron, as well as secondary electron and ion detectors, collect topographic, elemental, and compositional information from a variety of angles.
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This week's Question: Amazon recently filed a patent for parachute-aided delivery of packages. The proposed idea imagines drones releasing parcels from the sky, deploying parachutes to slow their descent and ensure the valuables inside remain...
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