2012

Avionics Reliability – Thermal Design Considerations

Please Login at the top
of the page to download.

Thermal design for reliability faces challenges from power dissipation demands from increased processing, sensing and communication requirements plus targets for size, weight and operation. Address thermal challenges effectively with electronics cooling simulation that brings electronic and mechanical design flows closer.

 

 

 

 

 

 

White Papers

Putting FPGAs to Work in Software Radio Systems
Sponsored by Pentek
Aqueous Critical Cleaning: A White Paper
Sponsored by Alconox
IEC 61131-3 Now in Motion
Sponsored by Trio Motion
SpaceClaim in Manufacturing
Sponsored by SpaceClaim
Designing Ring Projections for Hermetic Sealing
Sponsored by Miyachi Unitek
When Wire Feedthroughs Make Sense
Sponsored by Douglas Electrical Components

White Papers Sponsored By: