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Linear Photodiode Array

Sensors Unlimited, Inc. (Princeton, NJ) introduces the LC Series Linear Photodiode Array. The SU256LCS-2.6T2 detector array is available with 256 elements of extended response InGaAs material and is designed for wavelength range from 0.9 microns to 2.6 microns. The LC photodiode array package design includes a two-stage TEC and thermally optimized materials for multi-channel spectrometers that require high sensitivity, low power consumption, and long-term stability. Applications include biomedical analysis and industrial process control.

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Wafer Scanner

The Wafer Scanner 3840™ from Rudolph Technologies (Flanders, NJ) is for inspection and metrology of back-end semiconductor manufacturing processes, including bumping, probing, sawing, and dicing. The WS 3840 Inspection System uses Rudolph’s laser triangulation technology to provide fast and accurate measurements of bump height and coplanarity. A time delay integration (TDI) line scan camera provides image-based macro defect inspection for wafer surface and bump, and measures 2D bump characteristics, such as diameter, shape, and placement accuracy.

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Modular Vision Sensor Platform

LMI Technologies, Inc.(Vancouver, Canada) has released the FireSync™ platform that allows developing a single unified design for building vision applications ranging from smart sensors to complex web scanning systems, from specification to final assembly. The FireSync™ platform consists of tightly integrated OEM hardware and software components that include sensor controllers, camera and embedded sensors, machine vision software, industrial computers, and lighting. Components selected can be configured in a number of different ways.

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Brain-Machine Interfaces



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Gesturing Medical Procedures



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Laptop Refrigerator



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New Mineral



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