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UV Laser Systems

J. P. Sercel Associates (JPSA, Hollis, NH) has released the IX-200 series laser systems, available in DPSS solid-state and excimer UV laser configurations. The IX-200 ChromaDice™ DPSS version is a wafer dicing system suitable for wafer trimming and scribing applications. The process is tolerant of wafer warp and bow, and is suitable for all wafer types. The IX-200 excimer laser version is suitable for via drilling, micromachining, thin film patterning, and semiconductor packaging applications including LED liftoff.

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Midget Flange LED Lamp

DDP (El Segundo, CA) has introduced a warm-white midget flange LED lamp designed to retrofit and replace incandescent light bulbs. The T1 3/4 LED can be used in indicators for backlighting switches, pushbutton rockers, and panel builders in harsh conditions such as off-highway, transportation, military/ aerospace, and industrial applications. The LEDs provide a clean white light without any color mixture for applications that require specific color and brightness levels. The LED features an industry-standard mount and is available in 6V, 12V, 14V, 24V, and 28V versions. It also works with a variety of color lenses.

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Light-Emitting Diodes

OSRAM Opto Semiconductors (San Jose, CA) offers an enhanced line of Power TOPLED® light-emitting diodes (LEDs) that features the company’s thin-film chip technology within the packages that produces brighter light. Lensed Power TOPLED 30° and 60° devices provide matched radiation patterns in all colors, delivering higher intensity light in a more uniform and focused beam. Available indium gallium nitrite (InGaN) colors include blue and true green in all radiation patterns, along with InGaN white devices in the standard package.

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Optical Design Software

RSoft Design Group (Ossining, NY) offers Optical Communication Design Suite Version 4.6 software, including OptSim and a multimode add-on called ModeSYS. The new release provides support for new applications including Electronic Dispersion Compensation, 40-Gigabit-per-second systems, RF Photonics (Radio-over-Fiber links), DPSK systems, FTTx PON, and high-power optical amplifiers. The BER estimation technique for accurate treatment of noise statistics is based on Karhunen-Loeve series expansion for optical signal and noise.

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Regenerative Laser System

ELS Electronic Laser System (Fort Worth, TX) has released the PowerDisk regenerative laser system that produces pulses with up to 25 mJ energy and 10-ns duration at 1 kHz. The repetition rate can be selected between 1 kHz and 100 kHz. The system is based on the VersaDisk thin-disk laser as a seed laser. The fundamental wavelength can be set between 1010 nm and 1055 nm. To narrow the linewidth of the seed laser to 5 MHz, an etalon is inserted into the optical cavity.

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High-Power LEDs

American Bright Optoelectronics Corp. (Chino, CA) has introduced the BWL-3B series of 3-watt, high-power LEDs in a 9 × 9-mm package that consists of multiple dice in a single multi-leaded package. This packaging allows for each die to be both independently addressable and assignable. The design allows for stage powering of the device in 1-watt increments, providing three separate flux intensities without the need for complex controllers or specialty drivers.

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Spectroscopic Reflectometer

HORIBA Jobin Yvon (Edison, NJ) offers the DigiScreen spectroscopic reflectometer capable of measuring film thickness deposited on a large-area glass substrate in less than one second. With a spectral range of 400 nm to 800 nm, the DigiScreen can measure film thickness from 100 nm to several microns, and accepts sample sizes up to 2.5 × 2.7 m. The sample is manually loaded on a vertical, large-area motorized stage tilted at an angle of 10°. A Quartz Tungsten Halogen (QTH) light source coupled to an optical fiber is focused onto the sample, giving a spot size of 2 mm in diameter. A second optical fiber collects the light reflected from the sample. A 2048-pixel CCD coupled with a spectrograph measures the reflectance of the sample. The system can characterize materials such as SiN, SiON, a-Si(n+), a-Si (HDR, LDR), LTPS, c-Si, Silane-based SiOx, and TEOS.

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