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Miniature Control Chip Drives James Webb Telescope Signal

SIDECAR ASIC microprocessor-controlled chip Teledyne Imaging Sensors Camarillo, CA 805-373-4545 www.teledyne-si.com The electronics that will convert analog signals to digital signals on the James Webb Space Telescope (JWST), being built by Northrop Grumman and managed by NASA’s Goddard Space Flight Center, have been miniaturized to take up less space and to weigh less. The electronics also will provide better images of objects in space when they are sent back to scientists on Earth.

Posted in: Application Briefs

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Green Energy for the Battlefield

The amount of energy the United States consumes increases every year and this growth in energy consumption outpaces energy production. To fill this gap, the U.S. imports 35% of its energy. More importantly, the U.S. imports over 60% of its total oil consumption. Added to this, 70% of this energy is from non-renewable sources.

Posted in: Articles

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Compact, Single-Stage MMIC InP HEMT Amplifier

This amplifier exhibits gain of 5 dB at 340 GHz. Figure 1 depicts a monolithic microwave integrated-circuit (MMIC) single-stage amplifier containing an InP-based high- electron-mobility transistor (HEMT) plus coplanar-waveguide (CPW) transmission lines for impedance matching and input and output coupling, all in a highly miniaturized layout as needed for high performance at operating frequencies of hundreds of gigahertz. This is one in a series of devices that are intermediate products of a continuing effort to develop advanced MMIC amplifiers for sub-millimeter-wavelength imaging systems, scientific instrumentation, heterodyne receivers, and other applications.

Posted in: Briefs, TSP

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Super-Earths



Posted in: Blog

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NASA Briefs

Ames Research Center is developing a wireless-communication and data-processing system that would use radio-frequency identification devices(RFIDs) and software to establish information lifelines between firefighters in a burning building and a fire chief at a control station. The system would identify trails that firefighters could follow to escape from the building, and new trails if previously established trails become blocked. Click here for more info.

Posted in: Blog

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Virus Image



Posted in: Blog

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MEMS/ECD Method for Making Bi2–xSbxTe3 Thermoelectric Devices

Devices containing diverse materials in complex three-dimensional shapes can be fabricated. A method of fabricating Bi2–xSbxTe3-based thermoelectric microdevices involves a combination of (1) techniques used previously in the fabrication of integrated circuits and of microelectromechanical systems (MEMS) and (2) a relatively inexpensive MEMS-oriented electrochemical- deposition (ECD) technique. The devices and the method of fabrication at an earlier stage of development were reported in “Sub milli meter-Sized Bi2–xSbxTe3 Thermoelectric Devices” (NPO-20472), NASA Tech Briefs, Vol. 24, No. 5 (May 2000), page 44. To recapitulate: A device of this type generally contains multiple pairs of n- and p-type Bi2–xSbxTe3 legs connected in series electrically and in parallel thermally. The Bi2–xSbxTe3 legs have typical dimensions of the order of tens of microns. Metal contact pads and other non-thermoelectric parts of the devices are fabricated by conventional integrated-circuit and MEMS fabrication techniques. The Bi2–xSbxTe3 thermoelectric legs are formed by electrodeposition, through holes in photoresist masks, onto the contact pads.

Posted in: Briefs

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