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COM Express Embedded Modules

VIA Technologies (Taipei, Taiwan) has extended their embedded board portfolio to include COM Express™ modules. Measuring 95mm x 125mm, COM Express is an industry standard embedded form factor developed by the PICMG (PCI Industrial Computer Manufacturers Group). The COM Express specification integrates core CPU, chipset, and mem ory on the mod - ule, providing support for extensive con - nectivity options, in - cluding USB, audio, graphics, and Ether - net, through boardto- board connectors to an I/O baseboard.

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VPX SerDes Test Modules

Elma Electronics Inc. (Fremont, CA) has released the SerDes Test Modules for VPX systems. The modules are being offered in partnership with DFT Microsystems, a leader in high-density test solutions for highspeed semiconductor device interfaces. The SerDes modules are designed to plug into VPX backplanes and directly test the channel compliance. They can be used to test VPX switch and node cards and/or the backplane channels without requiring external equipment or special test fixtures.

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EPIC and EBX Enclosures

WinSystems (Arlington, TX) has released the ENC-EPXG- 1000 enclosure for EPIC (Embedded Platform for Industrial Computers) and the ENC-EBC-G-1000 enclosure for EBX single board computer (SBC) systems. They are designed for embedded applications requiring mounting inside NEMA boxes, OEM machinery, wiring closets, equipment rooms, and other areas where it is necessary to protect an EPIC or EBX Single Board Computer system with PC/104 expansion. The enclosures are made from rustproof, lightweight aluminum. Aluminum is non-combustible, non-magnetic, non-sparking, non-toxic, recyclable, and thermally conductive to dissipate component heat.

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Core2 Duo COM Express Module

Ampro Computers Inc. (San Jose, CA) has released a computer- on-module (COM) based on Intel’s Core2 Duo processor and GME965 chipset. The COM 840 integrates a single- or dual-core processor, Ram, graphics, networking, and PCI Express expansion in a 3.7 × 4.5-inch module that operates from - 40 to +85°C. The COM 840 has a 1.66Hz Intel® Core2 Duo L7500 processor with 4 MB of on-chip L2 cache, 800 MHz FSB (front side bus), and two SODIMM sockets for up to 4 GB of DDR2 RAM.

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Brain-Machine Interfaces



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Gesturing Medical Procedures



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Laptop Refrigerator



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