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Multi-I/O PMC

Aitech Defense Systems Inc. (Chatsworth, CA) offers a compact, multi-I/O PMC for I/O environments. The low-power, single-width M705 features up to five dual-channel, dual-redundant MIL-STD-1553B channels, 16 ARINC-429 receive channels and eight ARINC-429 transmit channels, up to six RS-232/422/485 serial channels and eight opto-isolated digital discrete input channels, all of which reduce the number of I/O cards when developing subsystems. Additional board options include an ARINC 708 Weather Radar interface contained as VHDL within the large onboard FPGA.

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CompactPCI Camera Link Frame Grabber

Active Silicon (Chelmsford, MA) has released the Phoenix D48CL-3CPCI32, a conduction-cooled, 3U CompactPCI Camera Link frame grabber. Designed for extremely rugged environments, the Phoenix operates in temperatures of -40 °C to +85 °C. The board is suitable for harsh environments found in industrial, military, and aerospace applications. The Phoenix D48CL-3CPCI32 utilizes rear panel I/O and supports the 32-bit/66MHz CompactPCI bus. The Camera Link interface encompasses dual Base/single Medium configurations, including PoCL cameras at 60MHz pixel clock rates.

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Potting and Encapsulation UV Adhesive

Master Bond (Hackensack, NJ) has introduced Master Bond UV10SP-2A, a one-component, flexible, UV curable polymer system for bonding, sealing, and coating with an attractive balance of pertinent physical, electrical, and chemical properties. The 100% reactive, moderate viscosity liquid at ambient temperatures does not contain any solvents or other volatiles. When exposed to a UV light source, Master Bond Polymer System UV10SP-2A cures as a durable, tough, non-yellowing system that can be used as an adhesive, sealant, and coating.

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Separation Kernel and Embedded Hypervisor

LynuxWorks (San Jose, CA) unveiled the LynxSecure 2.0, its next-generation separation kernel and embedded hypervisor. LynxSecure 2.0 virtualizes the underlying hardware to enable multiple different operating systems (OS) to co-exist on the same platform. Consolidating heterogeneous OS environments reduces hardware costs and allows for easier reuse of legacy software.

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Networked Intelligent Display and Serial-to-Ethernet Modules

Luminary Micro (Austin, TX) has released communications modules and reference design kits for Ethernet-enabled display applications and serial- to-Ethernet communications applications. The compact networked Intelligent Display Module (MDL-IDM) offers a complete graphical touch-screen user interface solution for control, automation, and instrumentation. Featuring a 2.8-in. QVGA 16-bit color LCD resistive touch panel display and a Power- over-Ethernet (PoE) capability, the Stellaris MDLIDM offers a simple method to produce intelligent terminals that can be simultaneously powered and network-connected by a single CAT5 Ethernet cable. The module can also be powered with a standard 24 V DC power supply or through 5 V DC terminals.

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New Embedded Form Factor

Congatec AG (Deggendorf, Germany) and SECO (Arezzo, Italy) have jointly created a new form factor for embedded computing. The Qseven format will complement the low power and small size of next-generation embedded processors built using 45nm technology. The Qseven format offers high-performance computing power delivered in a board measuring just 70mm × 70mm

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Quad- and Dual-Core Processors

Intel Corporation (Santa Clara, CA) has released new processors with extended seven-year lifecycle support, a new chipset, and a carrier-grade server. The processors are based on Intel’s high-k, metal gate transistor formula and manufactured on the company’s 45-nanometer process. The processors include the Quad-Core Intel® Xeon® processor 5400 Series and the Dual-Core Intel "Xeon" processor 5200 series.

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