Photo-Etched Lead Frames
- Tuesday, 16 July 2013
Photofabrication Engineering (PEI) (Milford, MA) has expanded its manufacturing capabilities for custom-designed, photochemically-etched surface-mount and insert-mount lead frames for integrated circuit manufacturing. These lead frames are used in a variety of applications including semiconductors, glass-to-metal seals, and relays, as well as medical applicationss. Using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel, PEI can plate lead frames in their entirety or selectively. Lead-free plating materials include silver, nickel, gold, or tin. PEI’s lead frames range in thickness from 0.5 mil [0.0127 mm] to 40 mil [1.575 mm], with features as small as 4 mil [0.10 mm] on 0.010 in. [0.254 mm] centers, creating lead frames that are strong enough to be handled yet flexible enough to allow bending when necessary.