The Versa 3D™ DualBeam™ system from FEI
Company (Hillsboro, OR) provides high-resolution,
three-dimensional imaging on a range of
sample types. Versa 3D is available with either
high-vacuum-only or high- and low-vacuum electron
imaging hardware. New features, such as
FEI’s SmartSCAN™ and Drift Corrected Frame
Integration (DCFI), facilitate electron beam imaging
of sample types with a range of different
properties. Advanced backscattered electron, as
well as secondary electron and ion detectors, collect topographic, elemental,
and compositional information from a variety of angles.
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