Thermally Conductive Epoxies Optimize Electronic Assemblies
- Wednesday, 15 January 2014
Please Login at the top
of the page to download.
The use and selection process of thermally conductive epoxies can make or break your application. Too much heat can lead to component malfunction or prematurecomponent failure while the inability to stay below specified temperature limits may result in irreversible damage and permanent performance shifts. Master Bond’s white paper compiles the most important considerations for the selection of epoxies for efficient thermal management.