Micro-Textured Black Silicon Wick for Silicon Heat Pipe Array
NASA’s Jet Propulsion Laboratory, Pasadena, California
Friday, March 01 2013
This technology can be used for microprocessors, power
switching circuits, and diode lasers in high-power electronics.
Planar, semiconductor heat arrays have
been previously proposed and developed;
however, this design makes use of a novel,
microscale black silicon wick structure
that provides increased capillary pumping
pressure of the internal working fluid,
resulting in increased effective thermal
conductivity of the device, and also
enables operation of the device in any orientation
with respect to the gravity vector.
Viewing entire briefs requires login/registration.
Registration is free and easy to complete.
If you're already registered with Tech Briefs, simply login at the top of the page.
Subscribe today to receive the INSIDER, a FREE e-mail newsletter from NASA Tech Briefs featuring exclusive previews of upcoming articles, late breaking NASA and industry news, hot products and design ideas, links to online resources, and much more.