An integrated waveguide-to-MMIC
(monolithic microwave integrated circuit)
chip operating in the 300-GHz
range is designed to operate well on highpermittivity
semiconductor substrates typical
for an MMIC amplifier, and allows a
wider MMIC substrate to be used,
enabling integration with larger MMICs
(power amplifiers). The waveguide-to-
CBCPW (conductor-backed coplanar
waveguide) transition topology is based
on an integrated dipole placed in the Eplane
of the waveguide module. It
demonstrates low loss and good impedance
matching. Measurement and simulation
demonstrate that the loss of the
transition and waveguide loss is less than
1-dB over a 340-to-380-GHz bandwidth. A transition is inserted along the
propagation direction of the waveguide.
This transition uses a planar dipole
aligned with the maximum E-field of the
TE10 waveguide mode as an inter face
between the waveguide and the MMIC.
Mode conversion between the coplanar
striplines (CPS) that feed the dipole and
the CBCPW transmission line is accomplished
using a simple air-bridge structure.
The bottom side ground plane is
truncated at the same reference as the
top-side ground plane, leaving the end
of the MMIC suspended in air.
This work was done by Kevin M. Leong,
William R. Deal, Vesna Radisic, Xiaobing
Mei, Jansen Uyeda, and Richard Lai of
Northrop Grumman Corporation, and Lorene
A. Samoska, King Man Fung, and Todd C.
Gaier of Caltech for NASA’s Jet Propulsion
Laboratory. The work was sponsored under
the DARPA SWIFT program and the contributors
would like to acknowledge the suppor t of
Dr. Mark Rosker (DARPA) and Dr. H. Alfred
Hung (Army Research Laboratory). For more
infor mation, download the Technical
Support Package (free white paper) at
www.techbriefs.com/tsp under the Semi -
conductors & ICs category. NPO-46237
This Brief includes a Technical Support Package (TSP).
Waveguide Transition for Submillimeter-Wave MMICs (reference NPO-46237) is currently available
for download from the TSP library.
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