Electrochemical deposition is the key to mass-producibility.

Submillimeter-sized thermoelectric devices based on thick films of Bi_2–xSb_xTe₃ are undergoing development. As electronic circuits are designed with ever greater packaging densities and power densities, there is an increasing need for small thermoelectric devices to provide active spot cooling for power amplifiers and other heat-generating electronic components. Bi_2–xSb_xTe₃ is the preferred thermoelectric material for the operational temperature range (<200 °C) of typical advanced microelectronic components. Bi_2–xSb_xTe₃ thermoelectric devices could also be used as electric-power generators; moreover, because of the smallness of the thermoelectric legs in these devices, the numbers of legs can be of the order of 100 times those of conventional bulk thermoelectric devices, making it possible to generate higher potentials (of the order of 100 V), that are more compatible with other electronic components.