An organization seeks printing technologies to produce higher-current miniature circuitry. Approaches of interest include reducing use of expensive inks, eliminating a plating step, and increasing adhesion to a variety of substrates. An additional area of interest is to enable multilayer structures for more complex circuitry. The company would consider an alternate ink material that may have lower viscosity but can produce the trace thickness capable of handling sufficient current; higher silver loadings (on the order of 40-60%); or an inexpensive seed ink that could be electroplated (or used with electroless deposit), and then electroplated afterwards.
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