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As components shrink, embedded systems have made their way into smaller and more mobile applications. Systems need to withstand more intense vibration, shock and EMI parameters and still function effectively. All of this affects the ruggedization of enclosures.

Today’s enclosures are viewed as a much more integral part of the overall system — not just a means to keep all the components protected and in place. Size, weight, power and cooling pose increasing thermal challenges when selecting the housing for electronics.

This white paper by Elma offers ideas on how to address the increasingly challenging thermal and environmental conditions designers face when packaging electronics.

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