This technology provides isolated polynucleotides comprising a nucleotide sequence encoding a mature thermophillic hydrophobin polypeptide suitable for a recombinant DNA technology production process. This compound self-assembles at interfaces and is applicable to a broad variety of surfaces. It is extremely heat-tolerant — up to 50 °C. Applications include coatings for medical implants and drug delivery solutions.

The present invention concerns isolated polynucleotides comprising a nucleotide sequence encoding a mature thermophilic hydrophobin polypeptide wherein the amino acid sequence of the polypeptide and the amino acid sequence of SEQ ID NO:1, representing mature TT1.

In a first embodiment, the present invention includes an isolated polynucleotide comprised of: (a) a nucleotide sequence encoding a thermophilic hydrophobin polypeptide, wherein the polypeptide has an amino acid sequence of at least 80%, 85%, 90%, or 95% sequence identity, based on the Clustal W method of alignment, when compared to SEQ ID NO:1 or (b) a complement of the nucleotide sequence, wherein the complement and the nucleotide sequence consist of the same number of nucleotides and are 100% complementary. The polypeptide preferably comprises the amino acid sequence of SEQ ID NO:1. The nucleotide sequence preferably comprises the nucleotide sequence of SEQ ID NO:2.

In a second embodiment, the present invention includes a vector comprising any of the isolated polynucleotides of the present invention.

In a third embodiment, the present invention concerns a recombinant DNA construct comprising any of the isolated polynucleotides of the present invention operably linked to a secretion signal peptide coding sequence and at least one regulatory sequence.

In a fourth embodiment, the present invention concerns an isolated thermophilic hydrophobin polypeptide, wherein the polypeptide has an amino acid sequence of at least 80%, 85%, 90%, or 95% identity, based on the Clustal W method of alignment, when compared to SEQ ID NO:1. The polypeptide most preferably comprises SEQ ID NO:1.

In a fifth embodiment, the present invention includes a composite structure comprising a polymer material having a thermophiic hydrophobin coating.

In a sixth embodiment, the present invention provides a method of treating the surface of an object with a hydrophobin that is performed at a temperature in the range of greater than 25 °C to about 100 °C.

This technology is offered by DuPont. For more information, view the yet2.com TechPak at http://info.hotims.com/34450-138 .