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The Dusk of Fire-Wire, The Dawn of USB 3.0: Advancements and critical aspects of camera interfaces for next generation vision systems

Before 2011, many system designs were built on the most popular interface at the time: FireWire. This technology is slowly becoming obsolete and is commonly being replaced by USB 3.0, the new predominant interface for industrial and scientific cameras. In this paper we will outline why people are making the upgrade from FireWire to the USB 3.0 interface, and why USB 3.0 is here to stay.

Posted in: White Papers, Imaging, Medical, Optics, Photonics

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Selecting the Right Vent to Extend the Lifetime of Electronic Components in Vehicles

Electronic components are rapidly replacing mechanical parts in automobiles. Suppliers must protect these electronic components from harsh contaminants and temperature fluctuations, to ensure reliable performance. Selecting the right venting solution can help to extend the life of the electronic component.

Posted in: White Papers, Automotive, Electronic Components, Electronics & Computers

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RF & MW Control Products in Silicon

Analog Devices’ new RF and microwave (MW) switch and attenuator products implemented in advanced silicon process benefit inherent advantages of silicon technology compared to legacy counterparts using gallium-arsenide (GaAs). This paper provides highlights on features and key performance parameters of the new switch and attenuator products.

Posted in: White Papers, Electronics & Computers, Semiconductors & ICs, Data Acquisition, Sensors

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A Robust Supply Chain: The Important Role Your Contract Manufacturer Can Play

Your complex device demands a robust supply chain. In today’s unsure environment, you need to know that your supply chain is available, flexible, and affordable when you need it. Establishing a strong and effective partnership with a contract manufacturer can ensure that you have the purchasing power and agility needed when the unexpected happens or design changes are needed. “A Robust Supply Chain,” our White Paper, outlines three things to look for in a contract manufacturer and three things you can do to ensure a smooth production process and an improved bottom line.

Posted in: White Papers, Manufacturing & Prototyping

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Ultra Low Thermal Resistant Adhesives for Electronic Applications

As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability. As product manufacturers face greater challenges in assembling die, package, and other components into products able to cope with increasing heat loads, adhesives are particularly versatile for bonding, sealing and coating. Moreover, the use of filler materials in adhesives can help to fine tune the specific performance demands required to extend product lifecycles and meet manufacturing requirements. Learn more about why and how ultra low thermally conductive adhesives are the preferred fastening approach in applications requiring careful thermal management.

Posted in: White Papers, Materials

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Adhesives, Sealants and Coatings for the Aerospace Industry

From prototype to assembly line, our materials have aided in the success of many companies across the aerospace industry. This 28 page catalog features a variety of products that are widely used for structural bonding, sealing and gap filling. These formulations ensure reliability in the assembly of aircraft structures, components, interiors and MRO applications.

Posted in: White Papers, White Papers, Aerospace, Materials

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Evaluating Electrically Insulating Epoxies

Dielectric constant, dissipation factor, dielectric strength, surface and volume resistivity are all fundamental electrical properties of epoxies. How they are measured, what values are desirable and how they react to changes in temperature, fillers and other variables are considered in this paper. The specific composition of resin and curing agents will also affect the electrical properties of a cured epoxy system. Three major types of curing agents are explained in this paper along with their benefits and trade-offs with respect to electrical properties.

Posted in: White Papers, Materials

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