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Electrical and Mechanical Integration in Aerospace Design

This paper addresses the issue of increasing complexity of today's aerospace electrical systems. Manufacturers now seek a high degree of integration between their business and design tools. MCAD, ECAD, PLM, PDM, Workflow and ERP systems are no longer selected purely through their individual functionalities, they must also integrate - and the integration must include all data in the process.

Posted in: Electronics & Computers, White Papers

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Building a Test System for High-Speed Data Streaming Applications

High-speed data streaming applications typically require maximum accuracy and long sampling times, including such applications as spectral monitoring, signal intelligence, LIDAR testing, optical fiber testing, radar and satellite signal acquisition, and software defined radio systems. These present unique engineering challenges requiring high throughput, and identifying design flaws and problems can contribute to reduced development costs and time to market, avoiding field recalls and costly system redesigns. The white paper discusses techniques for optimizing configuration of systems supporting high-bandwidth applications, by: Enabling high-speed real-time data streaming Designing applications optimizing system streaming performance Furnishing benchmarks that can be achieved in stream-to-disk and stream-to-memory applications

Posted in: Test & Measurement, White Papers

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Improving Cable Performance in Harsh Environments

Cables are often the last component considered during system designs. In many situations, cables are really the system’s lifeline — if a cable goes down, the entire system can stop. For example, if the cable system used for data transmission in a spacecraft fails, the communication between the craft and mission control could be lost. Cable reliability is based on both durability and signal integrity, and the ideal cable system should be engineered to last the life of the product in any environment.

Posted in: Electronics & Computers, White Papers

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Increasing Automotive Safety Through Embedded Radar Technologies

In response to a need for active and predictive safety systems within the automotive sector, semiconductor suppliers are developing innovative radar-based embedded solutions. These next-generation technologies present unique capabilities for designers of Advanced Driver Assistance Systems (ADAS), enabling life-saving safety features as well as compliance with the latest regulatory standards.

Posted in: Semiconductors & ICs, White Papers

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Using Acoustic Beamforming for Pass-By Noise Source Detection

This application note discusses a technique known as beamforming for determining noise location of passing vehicles. The technique has several challenges including simultaneous acquisition of a large sensor array, advanced signal processing and storage of extremely large data sets, and the environmental considerations required for operating outdoors on a test track. This application note recommends best practices for performing beamforming and walks through the complete system required from the test environment to the sensors to the math, analysis, and data storage with the goal of the reader being able to apply the technique.

Posted in: Test & Measurement, White Papers

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Optimum Fastener Selection for Internal Pumping in Vacuum Systems

The use of fasteners inside of vacuum chambers, while necessary for obvious reasons, can present a number of problems resulting from trapped volumes. Trapped volumes of gas, typically air trapped during assembly, within vacuum chambers are not easily found and can be difficult to pump out, often appearing later as “virtual leaks”. Fasteners also, due to their helix design, have a large surface area relative to their size, creating an un-exposed water-retaining surface. Fortunately there are optimal fastener configurations that address these issues.

Posted in: Semiconductors & ICs, White Papers

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A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly

As semiconductor processing has moved to 300mm wafers, the size of deposition targets, including tungsten (W), tantalum (Ta), and molybdenum (Mo), has grown, and process complexity has increased as well. This added size and complexity contributes to the stress on a target assembly during the physical vapor deposition (PVD) process, and the target assembly’s ability to withstand this stress has a large effect on the resulting deposition rates, yields, and film properties. One of the major sources of stress is the coefficient of thermal expansion (CTE) mismatch between metal targets in semiconductor processes, such as tungsten (CTE of 4.5*10-6/°C), tantalum (6.5*10-6/°C), and molybdenum (5.1*10-6/°C) compared with their backing plates, which are typically made of aluminum (23*10-6/°C), brass (21.2*10-6/°C), or copper-chrome (17.6*10- 6/°C). Standard soldering and solid state joining processes have difficulty controlling stress produced by the CTE-mismatch. We will demonstrate how the NanoBond® process can be used to control stresses during the bonding and deposition processes. Modeling will be conducted to compare standard bonding processes to the NanoBond process, accounting for CTE mismatches.

Posted in: Materials, White Papers

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