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Reducing Development Cycles for 3U VPX Systems

This white paper outlines the key challenges system integrators face when building a system with 3U VPX COTS-based solutions.

Posted in: White Papers, White Papers, Defense, Electronics & Computers

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Multi-channel, Multi-board Coherency for SWaP-Constrained SIGINT and EW

This white paper discusses beamforming for SIGINT and EW, then looks at why coherency across multiple input channels is key to implementing efficient beamforming.

Posted in: White Papers, White Papers, Defense, Electronics & Computers

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Enabling Complex Applications with a Dual Node Single Board Computer

Read about a new approach to SBC design that delivers more processing power and better SWaP characteristics along with support of software reuse and advanced security functions.

Posted in: White Papers, White Papers, Defense, Electronics & Computers

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Avoiding Common Mistakes in Extractables/Leachables Program Design

Mistakes in program design for extractables/leachables testing can lead to significant delays, rounds of questions, and the need for additional testing. And, in some cases, all of the extractables/leachables testing may need to be repeated. To avoid these costly mistakes, it is important to understand the current standards as well as the current interpretations and opinions from regulators interpreting these standards. In this whitepaper the experts from WuXi AppTec discuss the current standards, interpretations and will provide you with tips to avoid common mistakes when designing your program.

Posted in: White Papers, White Papers, Medical

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External Power Supply Efficiency Regulation Introduction

Presently Energy Efficiency Level V is mandatory in Canada and throughout Europe. In February 2016 Energy Efficiency Level VI will become mandatory in the United States. Attached are the details of the pending change, but in brief, both the standby power draw and efficiency of the operating power supplies must meet minimum levels set in the standard. MEGA is in the process of updating our product line to comply with the coming changes.

Posted in: White Papers, Electronics, Electronics & Computers

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Designing a Phased Array Antenna Using Antenna Magus and CST STUDIO SUITE

Antenna synthesis lets engineers investigate many potential designs and produce antennas that fit the specifications quickly. For effects that cannot be accounted for analytically such as edge effects and mutual coupling, full-wave 3D simulation can complement synthesis tools and allow designs to be checked and fine-tuned. This article explores the synthesis of an antenna array, using a phased array satellite communications antenna as an example.

Posted in: White Papers, White Papers, Aerospace, Software

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Adhesion Reduction of Semiconductor Dicing Tape

Many semiconductor wafer processing techniques involve the fixing of a thin layer of dicing tape to a wafer during the final processing stages. To allow removal of the die from the tape, the adhesion properties of the tape may be reduced with exposure to high-intensity UV light.

Posted in: White Papers, Coatings & Adhesives, Materials

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