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Broadening the Scope of User Requirements When Selecting Valves for Medical Devices

It is paramount to move beyond the specifications when identifying the best valve for a device. By broadening the scope of user requirements, one can ensure that a valve will function as expected over the device’s entire life cycle - from manufacturing through clinical use. Below are several requirements worthy of consideration. Although they are important, they often are unshared unless the valve supplier and device engineer engage in open communication early in the purchasing cycle.

Posted in: Bio-Medical, Custom & Contract Manufacturing, Medical, White Papers, MDB

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Electrical and Mechanical Integration in Aerospace Design

This paper addresses the issue of increasing complexity of today's aerospace electrical systems. Manufacturers now seek a high degree of integration between their business and design tools. MCAD, ECAD, PLM, PDM, Workflow and ERP systems are no longer selected purely through their individual functionalities, they must also integrate - and the integration must include all data in the process.

Posted in: Electronics & Computers, White Papers

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Increasing Automotive Safety Through Embedded Radar Technologies

In response to a need for active and predictive safety systems within the automotive sector, semiconductor suppliers are developing innovative radar-based embedded solutions. These next-generation technologies present unique capabilities for designers of Advanced Driver Assistance Systems (ADAS), enabling life-saving safety features as well as compliance with the latest regulatory standards.

Posted in: Semiconductors & ICs, White Papers

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Using Acoustic Beamforming for Pass-By Noise Source Detection

This application note discusses a technique known as beamforming for determining noise location of passing vehicles. The technique has several challenges including simultaneous acquisition of a large sensor array, advanced signal processing and storage of extremely large data sets, and the environmental considerations required for operating outdoors on a test track. This application note recommends best practices for performing beamforming and walks through the complete system required from the test environment to the sensors to the math, analysis, and data storage with the goal of the reader being able to apply the technique.

Posted in: Test & Measurement, White Papers

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Optimum Fastener Selection for Internal Pumping in Vacuum Systems

The use of fasteners inside of vacuum chambers, while necessary for obvious reasons, can present a number of problems resulting from trapped volumes. Trapped volumes of gas, typically air trapped during assembly, within vacuum chambers are not easily found and can be difficult to pump out, often appearing later as “virtual leaks”. Fasteners also, due to their helix design, have a large surface area relative to their size, creating an un-exposed water-retaining surface. Fortunately there are optimal fastener configurations that address these issues.

Posted in: Semiconductors & ICs, White Papers

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A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly

As semiconductor processing has moved to 300mm wafers, the size of deposition targets, including tungsten (W), tantalum (Ta), and molybdenum (Mo), has grown, and process complexity has increased as well. This added size and complexity contributes to the stress on a target assembly during the physical vapor deposition (PVD) process, and the target assembly’s ability to withstand this stress has a large effect on the resulting deposition rates, yields, and film properties. One of the major sources of stress is the coefficient of thermal expansion (CTE) mismatch between metal targets in semiconductor processes, such as tungsten (CTE of 4.5*10-6/°C), tantalum (6.5*10-6/°C), and molybdenum (5.1*10-6/°C) compared with their backing plates, which are typically made of aluminum (23*10-6/°C), brass (21.2*10-6/°C), or copper-chrome (17.6*10- 6/°C). Standard soldering and solid state joining processes have difficulty controlling stress produced by the CTE-mismatch. We will demonstrate how the NanoBond® process can be used to control stresses during the bonding and deposition processes. Modeling will be conducted to compare standard bonding processes to the NanoBond process, accounting for CTE mismatches.

Posted in: Materials, White Papers

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Achieving High Reliability SAC Solder Joints via Min Doping

In this study, the reliability of low Ag SAC alloy doped with Mn (SACM) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys. SACM is a patent pending alloy consisting of 0.5-1% Ag, 0.5-1% Cu, <0.1% Mn. SACM alloy achieved a higher drop test and dynamic bending test reliability than SAC105 and SAC305, and exceeded SnPb for many test conditions. More significantly, SACM matched SAC305 in thermal cycling performance. In other words, the low cost SACM achieved a better drop test performance than the low Ag SAC alloys, plus the desired thermal cycling reliability of high Ag SAC alloys. The mechanism for high drop shock performance and high thermal cycling reliability can be attributed to a stabilized microstructure, with uniform distribution of fine IMC particles, presumably through the inclusion of Mn in the IMC. The cyclic bending results showed SAC305 to be the best and all lead-free alloys were equal or superior to SnPb. The reliability test results also showed that NiAu is a preferred surface finish for BGA packages over OSP.

Posted in: Materials, White Papers

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