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Navigating the Intellectual Property Roadblocks to Open Innovation

In an effort to incorporate outside sources of innovation into their new product acquisition programs, there has been a significant increase in the number of firms opening their organizational boundaries to external ideas. Over the past few years, large multinational companies such as Kraft, IBM and 3M have initiated active open innovation (OI) programs. The benefits to the organization of accepting new product ideas are lower research and development costs and the more rapid procurement of new products to fuel sales, and to the submitter, this can be financially rewarding if their idea is selected for product development or commercialization. Consumer products giant Procter & Gamble estimates that as many as 1.5 million researchers and scientists could contribute materially to the efforts of their own 7,500 researchers and scientists in corporate research and development. However, the economic benefits of open innovation can be diminished if organizations do not effectively manage the legal issues and logistical challenges that are presented. They include the quality/quantity of submissions, and once received, what is the most efficient way to process the submissions received?

Posted in: Medical, White Papers

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Flexible, High-Resolution Position/Displacement for OEM Applications

Features1, 2 and 3 channel configurationsNanometer to sub-nanometer resolutionEasy, cost effective performance customizationCE and RoHS compliantSmall package sizingThirteen standard sensor options

Posted in: Sensors, White Papers

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Multi-Purpose Non-Contact Position/Displacement Sensing

FeaturesSupports both dual and single coil sensors Terminal I/O connections Auto-synchronization of multiple channels Analog DC and 4-20mA outputs Single ended, bipolar, and differential voltage outputs Front face coarse and fine calibration controls RoHS compliant and CE marked

Posted in: Sensors, White Papers

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Noncontact Differential Impedance Transducer

FeaturesTrue differential for common mode rejection at an economical price High precision eddy current balanced bridge technology Capable of subnanometer resolution Thermal stability ±.03% FS/°C, at null ±.005% FS/°C Small package size: just 7.7 cubic inches High sensitivity: up to 10V/mil (39mV/μm) Extremely linear, to 0.1% full range Single and dual channel configurations

Posted in: Sensors, White Papers

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Video: Sigma-5 with EtherCAT. Case Study of Sigma-5 with EtherCAT Plasma Cutting Application

Case study of project that included W.A. Whitney Co., Rockford, IL (OEM) and Waymatic, Inc., South Fulton, TN (End User)

Posted in: Machinery & Automation, White Papers

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