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Metal Stamping Design Guidelines

Metal Stamping provides an economical way to produce quantities of parts that can possess many qualities, including strength, durability, wear resistance, good conductive properties, and stability. In this paper, we are sharing some ideas that can help you design a part that optimizes all the features that the metal stamping process offers.

Posted in: Briefs, TSP, Aeronautics, Materials

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Electric Field Quantitative Measurement System and Method

This technology could be used for medical imaging, security applications, weather prediction, and nondestructive evaluation of composites and insulators.NASA Langley Research Center’s Electric Field Imaging (EFI) system is the only noncontact method capable of quantitatively measuring the magnitude and direction of electrostatic fields in near- and far-field applications. Based on low-cost, commercially available components, the EFI system uses measurement of very-low-current, human-safe electric fields to construct a three-dimensional image of objects and people based on their dielectric properties. This platform technology, originally developed for measurement of the efficacy of electrical shielding around cables, could be optimized for a variety of applications, including medical imaging, security and detection, weather and natural disaster prediction, and nondestructive evaluation of composites and insulators. The EFI system has the potential to offer a lower-cost, portable, and safer alternative to the imaging systems currently used in these applications.

Posted in: Briefs, Electronics & Computers

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Auto-Balancing Series-Stacked Input DC-DC Converter

This invention could enable practical, reliable, and efficient power conversion in high-voltage DC systems without power level limitation.ADC-DC converter that can operate from a high input voltage is needed for future high-power space applications. However, the selection of space-qualified, high-voltage transistors and filter capacitors for such a converter are very limited. The available high-voltage components have lower performance than lower-voltage components. One possible solution to this problem is connecting in series the inputs of multiple converters to lower the input voltage at the individual converter inputs. However, because of component tolerances, performance degradation, and transient events, this can result in an unbalanced voltage distribution throughout the various inputs. Excessive voltage on any of the stacked converters can damage components and cause a catastrophic failure. A circuit that could inherently balance the voltage between the inputs of multiple low-voltage DCDC converters would have better performance and reliability.

Posted in: Briefs, Electronics & Computers

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Larger-Area Integrated Electrical Metallization Dielectric Structures with Stress-Managed Unit Cells for Extreme- Environment Semiconductor Electronics Chips

Electronic circuits that operate in high temperatures are used in automobiles, airplanes, oil drilling operations, and many other applications.The use of patterned multiple layers of thin films of metal and dielectric to form integrated circuit interconnections of transistors and/or form on-chip circuit capacitors is well known to those skilled in the art of semiconductor microelectronic fabrication. Because differing layers of thin film materials have different physical and thermal expansion properties, it is also well known that stress is inherently present in these multilayer film structures on a microelectronic chip. The amount of stress changes with temperature and as a function of lateral feature size/area across the chip. When stress anywhere within a patterned metal film feature becomes critically large (i.e., the “yield stress” is exceeded), the metal film can physically crack, buckle, or delaminate from other layers, which usually damages/fails the intended electrical operation of the microelectronic circuit.

Posted in: Briefs, Electronics & Computers

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High-Temperature, Hydrophobic, Flexible Aerogel Composite and Method of Making Same

This technology is well suited for environments requiring insulation materials that can withstand temperatures of up to 1200 °C.NASA’s Glenn Research Center (GRC) has developed a method for fabricating low-density, flexible aerogel composites for use as thermal insulation for myriad applications. It is ideal for a variety of environments that require insulation materials that can withstand temperatures of up to 1200 °C. This innovation significantly advances the state of the art for composite insulation systems, reducing adherence problems and thermal conductivity limitations of conventional aerogel insulations while improving performance with lower weight, lower density, and higher efficiency, all factors contributing to greater applicability of aerogel insulation.

Posted in: Briefs, Materials

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Mechanical Components from Highly Recoverable, Low Apparent Modulus Materials

Shock-resistant material eliminates corrosion and polishes to a smooth surface finish.NASA’s Glenn Research Center has developed a new method for producing a shock- and corrosion-proof, superelastic, intermetallic material, NiTiNOL 60 (60NiTi), for use in ball bearings and other mechanical components. These superelastic materials can withstand tremendous loads and stresses without permanent deformation or denting. At the same time, the nickel-titanium alloy is immune to corrosion and rust, unlike mechanical components made from iron or steel. In addition, the material does not chemically degrade or break down lubricants, a common problem with existing bearing materials. This material is best suited for oil-lubricated rolling and sliding contact applications requiring superior and intrinsic corrosion resistance, electrical conductivity, and non-magnetic properties.

Posted in: Briefs, Materials

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Polyimide Wire Insulation Repair System

This technology provides permanent, flexible, and less intrusive wire repairs.NASA’s Kennedy Space Center (KSC) seeks to license its Polyimide Wire Insulation Repair System technology to industry. The Polyimide Wire Insulation Repair System is a kit consisting of thin film polyimide patches that are applied to damaged areas of wire insulation with a heating device that adheres the polyimide repair film into place. The technology has been prototyped and successfully tested by NASA and the Naval Air Systems Command (NAVAIR). Wire repairs made with this system are permanent, flexible, and much less intrusive than repairs made using current techniques and materials. The technology is well suited for all applications of polyimide and other high-performance polymer- jacketed wire constructions.

Posted in: Briefs, Materials

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