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PXI Embedded Controllers

The PXI-8104 and PXI-8183 embedded controllers from National Instruments (Austin, TX) are suitable for applications including consumer electronics, automotive, semiconductor, telecommunications, aerospace, and defense. The PXI-8104 is an Intel Celeron M 440 processor-based embedded controller for use in PXI and CompactPCI systems. The PXI-8104 controller has a 1.86 GHz processor and dual-channel 533 MHz DDR2 memory.

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COM Express Embedded Modules

VIA Technologies (Taipei, Taiwan) has extended their embedded board portfolio to include COM Express™ modules. Measuring 95mm x 125mm, COM Express is an industry standard embedded form factor developed by the PICMG (PCI Industrial Computer Manufacturers Group). The COM Express specification integrates core CPU, chipset, and mem ory on the mod - ule, providing support for extensive con - nectivity options, in - cluding USB, audio, graphics, and Ether - net, through boardto- board connectors to an I/O baseboard.

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VPX SerDes Test Modules

Elma Electronics Inc. (Fremont, CA) has released the SerDes Test Modules for VPX systems. The modules are being offered in partnership with DFT Microsystems, a leader in high-density test solutions for highspeed semiconductor device interfaces. The SerDes modules are designed to plug into VPX backplanes and directly test the channel compliance. They can be used to test VPX switch and node cards and/or the backplane channels without requiring external equipment or special test fixtures.

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EPIC and EBX Enclosures

WinSystems (Arlington, TX) has released the ENC-EPXG- 1000 enclosure for EPIC (Embedded Platform for Industrial Computers) and the ENC-EBC-G-1000 enclosure for EBX single board computer (SBC) systems. They are designed for embedded applications requiring mounting inside NEMA boxes, OEM machinery, wiring closets, equipment rooms, and other areas where it is necessary to protect an EPIC or EBX Single Board Computer system with PC/104 expansion. The enclosures are made from rustproof, lightweight aluminum. Aluminum is non-combustible, non-magnetic, non-sparking, non-toxic, recyclable, and thermally conductive to dissipate component heat.

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Core2 Duo COM Express Module

Ampro Computers Inc. (San Jose, CA) has released a computer- on-module (COM) based on Intel’s Core2 Duo processor and GME965 chipset. The COM 840 integrates a single- or dual-core processor, Ram, graphics, networking, and PCI Express expansion in a 3.7 × 4.5-inch module that operates from - 40 to +85°C. The COM 840 has a 1.66Hz Intel® Core2 Duo L7500 processor with 4 MB of on-chip L2 cache, 800 MHz FSB (front side bus), and two SODIMM sockets for up to 4 GB of DDR2 RAM.

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Product of the Month: Coherent OTDR

Anritsu Company (Richardson, TX) introduces the MW90010A Coherent OTDR (C-OTDR) that can detect faults with 10-meter resolution, and collect 1.2 million data points for accurate analysis on optical submarine cables up to 12,000 km in length. The C-OTDR captures waveform data, including cable loss, bending loss, and fiber length, and can measure optical submarine cables with optical repeaters spaced at intervals of 80 km or more. Its measurement size of 320 × 177 × 451 mm, and weight of

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Microscopy System

Toshiba Imaging Systems Division (Irvine, CA) has partnered with Olympus Canada (Markham, Ontario) to offer the High Definition Synergy-HD Microscope Imaging System, a new tool for clinical pathology and teaching. Olympus integrated Toshiba’s ultra-compact IK-HD1 3CCD HDTV camera with its line of clinical microscopes that feature objectives and optics well suited for digital imaging. The system includes a high-definition, 42" or 47" 1080p LCD monitor, and delivers video imagery in real time, displaying the entire slide at all ROIs and magnifications.

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