Laser Apparatus

Mobius Photonics (Santa Clara, CA) has been awarded U.S. Patent #7,443,903 for a new laser apparatus that has multiple synchronous amplifiers tied to one master oscillator. This fiber-based architecture scales up average power for integration into high throughput machine tools without sacrificing reliability. Conventional diode-pumped, solid-state lasers are incapable of this flexibility and scalability. The laser apparatus is ideal for cost-sensitive applications such as solar cell processing, PCB manufacturing, or display manufacturing.

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Handheld Spectrometer

The i-LAB® Hand Held Analyzing Spectrometer from MicrOptix Technologies (Wilton, ME) performs real-time measurement and analysis of liquids and solids in the visible light range from 400–700nm. Features include a variety of sample interface adapters for sample measurement in the laboratory, field, plant, and classroom environments. The10mm disposable SamplettesTM enable rapid and reliable liquid sample measurement. The spectrometer is able to store data for later uploading to a computer. The i-LAB is powered by three AA batteries and LEDs provide the primary light source.

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Damage-Resistant Mirrors

Saint-Gobain Crystals (Hiram, OH) has introduced high reflectors optimized for use with q-switched, solid-state lasers (Nd:YAG, NdYVO4, and Nd:YLF) operating in the near infrared and visible spectrum (1064nm, 1053nm, 532nm). The coatings on the beam delivery optics are designed to withstand high peak fluences and deliver over 99.5 percent reflectivity. The standard versions of these high-power, solid-state laser reflectors are supplied on 1 inch (25.4mm) or 2-inch (50.8mm) diameter fused silica substrates. They have a specified flatness of λ/10 (at 633nm) and a laser grade surface quality of 10-5 (over an 85 percent clear aperture).

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Dispersion Control Modules

OFS (Norcross, GA) has announced new additions to its FemtoCompTM Modules line of dispersion control technologies for ultra-short pulse lasers. The modules address the difficult-to-match, third- and fourth-order dispersions of commonly used grating compressors. There are four new FemtoComp Modules in addition to the original 1μm wavelength version: two pulse-stretcher modules for either the 1 or 1.55μm wavelength range, a polarization-maintaining module in the 1μm wavelength range, and a module for the .8μm wavelength range.

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Gold Series Panel PCs

Maple Systems, Everett, WA, has released three Gold Series panel PCs in contoured 10", 15", and 17" fanless models. All models feature Intel processors and are preloaded with Windows XP Pro. The fully functional PCs run most Windows-compatible industrial software applications, and are designed for tightly sealed environments where there is no available airflow. The touchscreen interfaces feature high-resolution, high-brightness TFTs that support 16.7 million (24-bit) colors. The fanless models come equipped with a 1.0-GHz Intel Celeron M ULV CPU, and employ a high-speed Ethernet port, two USB ports, and two serial ports on the 10" model, and four serial ports on the 15 and 17" models. Solidstate hard drives are available. With a 40-GB hard drive and 256 MB of flash memory, each model is expandable with numerous options such as 512-MB and 1-GB memory expansions, CD and DVD additions (including CD-ROM, CD-R/W, DVD-ROM, and DVD-R/W), and an 80-GB hard drive upgrade. All models are made with an anodized aluminum bezel, an electrogalvanized steel chassis, and a motherboard designed for harsh manufacturing environments. Applications include remote data entry, remote monitoring, and applications that require support for multiple devices.

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3D Stacked IC Technology (Esc Booth # 1535)

IMEC (Leuven, Belgium) has announced significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5μm Cu through-silicon vias (TSV). The 3D stacked integrated circuits will be further developed on 200mm and 300mm wafers, integrating test circuits from participating partners. The dies were realized on 200mm wafers in IMEC's reference 0.13μm CMOS process with an added Cu-TSVs process. For stacking, the top die was thinned down to 25μm and bonded to the landing die by Cu-Cu thermocompression.

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On-Chip Debug Solutions (Esc Booth #1840)

Macraigor Systems (Brookline Village, MA) has ported their proprietary OCDemon On-Chip Debug Technology to ARM Cortex-M3 processors and is offering full GNU toolsets to be used with these processors. Engineers developing applications for these new processors can control and debug their hardware designs and application software without the use of other system resources such as UARTs, Ethernet channels, or parallel ports. Macraigor’s JTAG interface devices are available for use with the ARM Cortex- M3 based cores as well as other ARM family devices including ARM 7, ARM 9, ARM 11, Freescale’s iMX series, XScale, and others.

Debug method is available for hardware initialization and debug as well as Flash EEPROM programming, kernel, driver, and application software debug.

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SMP Virtual Machine (Esc Booth #1610)

Aonix® (San Diego, CA) now offers the PERC Ultra SMP with support for multicore hardware. PERC Ultra SMP is a multiprocessor and multicore solution for complex mission-critical embedded and real-time Java applications. When the Java language, initially designed for multithreaded programming environments, is coupled with Aonix’s PERC Ultra SMP virtual machine, developers are able to leverage full SMP benefits without rewriting code originally designed to run in older, uniprocessor systems. PERC Ultra’s real-time garbage collector ensures that real-time microsecond response can be guaranteed even in missioncritical applications.

With PERC Ultra SMP, all Java threads access the same shared objects, making them free to relocate themselves within memory. It also allows threads to migrate between processors, a crucial element to load balancing in multicore systems. To handle these needs, Aonix has developed a special patent-pending synchronization technique that ensures that an application thread on one processor does not attempt to access an object while another process is relocating the desired object as part of the garbage collection process. This performance-optimized solution hinges on the generation of specialized code sequences by the PERC Ultra SMP JIT compiler and on an enhanced real-time garbage collection algorithm.

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Touchscreen Controller ICs (Esc Booth # 316)

Atmel® Corporation (San Jose, CA) has introduced charge-transfer, capacitive touchscreen controller ICs that are suitable for mobile phones and other personal electronics. Highly reliable standard Two Touch™ and Single Touch touchscreen controllers are available. Two Touch controller ICs can track and report one or two simultaneous touches as separate X and Y positions. Common user-initiated gestures, including tap, double tap, flick and drag, as well as two-touch gestures such as zoom in, zoom out, and rotate are implemented in the touchscreen controllers.

Users can also implement the touch surface as a combination of touch keys and scrolling devices for additional flexibility – this is configurable by the host processor through the industry standard two-wire, I2C compatible interface. For single touch applications, a unique single layer sensor minimizes the mechanical stack. The reduction of scatter and absorption of the available backlight results in improved light transmission and reduced power consumption.

The first Two Touch devices, AT42QT5320 and AT42QT5480, support screen sizes of up to 8" with a 16:9 aspect ratio. The single touch devices, AT42QT4120 and AT42AT4160, support screen sizes of up to 4.3" with aspect ratios of 16:9 or 4:3. The AT42QT5320 comes in a 5×5 mm QFN package. The AT42QT5480 is available in 5×5 mm BGA, a 7×7 mm QFN, and a 10×10mm TQFP package and also supports up to four user-controlled GPOs. All packages are RoHS-compliant.

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Bluetooth Modules (ESC Booth #1809)

Laird Technologies (St. Louis, MO) has introduced a range of Bluetooth® modules designed to support the demands of medical equipment manufacturers. Designed for data applications, the BTM411 is a fully integrated, sub-miniature Bluetooth data-oriented module based on Cambridge Silicon Radio’s BC04 chipset. Incorporating a full Bluetooth stack and supporting a serial port profile, the module provides a UART interface and comprehensive AT command set to allow easy interface to a host processor.

For medical products that require DSP applications, the BTM520 series offers a wide range of functions including a high-gain, multilayer ceramic antenna that provides +10dBm output for multimedia requirements. The integrated Bluetooth stack provides a comprehensive range of profiles. The 32-bit Kalimba DSP, running at 64MIPS, allows onboard implementation of a variety of advanced applications.

The modules are based on the latest Bluetooth standard, Version 2.1+EDR, and deliver Secure Simple Pairing. This allows for simpler user interfaces that make products easier to use and, subsequently, reduces support costs. Designed for high reliability, these modules support an industrial operating temperature range of -30ºC to +70 ºC.

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