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Microelectronics Package for Extreme Environments

The MSK Products Division of Anaren, Inc. is pushing the boundaries of hybrid microelectronic packaging. They have designed, built, and tested a high-temperature, co-fired ceramic (HTCC) electronics package for use in oil and gas drilling, operating over two miles underground. This has proved MSK's ability to push the boundaries for developing microelectronics packages to survive in difficult high-temperature environments. This capability is extremely valuable for oil and gas exploration as well as for high-temperature aerospace applications.

Posted in: White Papers, White Papers, Electronics

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Development of a Multi-User Modem for Space Telecommunications

This technology has applications in the cellphone industry. NASA’s Jet Propulsion Laboratory, Pasadena, California Efficient support of planetary surface missions typically requires an orbiting asset that acts as a relay point to/from Earth. Orbital relay passes are normally 5 to 15 minutes in duration over any specific landed site. When multiple landed assets are co-located or near-located in the same coverage circle of a single relay orbiter, their telecom relay support opportunities will overlap. This will be the case with cooperative lander missions, a lander-rover operations pair, distributed intelligent lander missions, and future deployment of multiple equipment components for support of complex sample return or manned operations. In these situations, the capability of simultaneous support to multiple landers is very valuable for mission performance and operations flexibility. This technology work enables simultaneous telecom support to multiple landers (Mars, Titan, Europa), and provides single-radio, multi-mode support to Entry, Descent & Landing (EDL) and emergency operations (e.g., demodulation + Open Loop Recording).

Posted in: Briefs, TSP

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Wire Bonding to Pads in Tilted Planes

This technique can be used in industries where devices need to be made smaller and lighter, such as medical, aerospace, automotive, and military. NASA’s Jet Propulsion Laboratory, Pasadena, California Scientific imaging arrays need to have their individual imaging elements arranged in a close-spaced mosaic. The typical single imaging element is a silicon chip mounted on a larger support frame. This excess area of the support frame takes away valuable imaging space from the mosaic. This appears as a grid of black (no data) in the overall mosaic image. Making the support frame smaller makes the amount of lost data smaller, and the imaging elements can be spaced more closely together. Eliminating the support frame altogether brings the imaging elements even closer. This is referred to as four-side buttable.

Posted in: Briefs, TSP

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cFE/CFS Evolution for Multicore Platforms

Goddard Space Flight Center, Greenbelt, Maryland This effort ports the Core Flight Executive (cFE)/Core Flight System (CFS) flight software architecture to multicore processor platforms, and provides mission developers with a common, flightready, flexible software environment that supports single, multi-processor, and multicore systems. Currently the cFE/CFS only supports single-core processors.

Posted in: Briefs, TSP

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Basics of Electric Heaters

Hotwatt has manufactured specialized electric heating elements for over 64 years, all made in the USA. Products include cartridge, air process, immersion, strip and finned strip, tubular and finned tubular, band, compressor crankcase, foil, flexible rope and ceramic heaters. We are a quality supplier to OEM's in the in industrial, medical, commercial appliance, packaging, instrumentation, aviation, transportation and military fields.

Posted in: White Papers, White Papers, Electronics

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Selecting the Right Vent to Extend the Lifetime of Electronic Components in Vehicles

Electronic components are rapidly replacing mechanical parts in automobiles. Suppliers must protect these electronic components from harsh contaminants and temperature fluctuations, to ensure reliable performance. Selecting the right venting solution can help to extend the life of the electronic component.

Posted in: White Papers, Electronic Components

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RF & MW Control Products in Silicon

Analog Devices’ new RF and microwave (MW) switch and attenuator products implemented in advanced silicon process benefit inherent advantages of silicon technology compared to legacy counterparts using gallium-arsenide (GaAs). This paper provides highlights on features and key performance parameters of the new switch and attenuator products.

Posted in: White Papers, Data Acquisition, Sensors

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