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Improvised Diagnostic Strategy for High-Side Switch Power Stage

This technique enables detection of when a power stage fault occurs, and the type of fault. Robert Bosch Engineering & Business Solutions Ltd., Bangalore, India A vehicle electronic control unit consists of various high-side power stages for driving different loads. Common faults that these power stages experience are Short Circuit to Battery (SCB), Short Circuit to Ground (SCG), and Open Load (OL). These faults can occur during either on-state or off-state of the power stage output. It is essential to diagnose a fault such as SCB during switch off-state, SCG during switch on-state, and OL during both on- and off-state of the switch in order to avoid system malfunction or power stage damage.

Posted in: Electronics & Computers, Briefs

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Connectors Outperform Hardwiring for Manufacturers and Their Customers

Many thousands of equipment manufacturers have switched from point-to-point (hard) wiring to connector-based cable assemblies in factory and process automation and control systems. Adopting progressive connectivity solutions has improved their unit costs and productivity. It allows them to turn around orders and complete installations much faster. With margins under increasing pressure, many OEMs have come to regard these benefits as a must-have. For many of their customers, the principal argument for connector-based wiring over hardwiring – a lower total cost of ownership over the service life of the machine – is equally compelling.

Posted in: Electronics & Computers, White Papers

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Powering Wearable Technology and the Internet of Everything

How are the billions of new wearable technology devices and Internet of Everything sensors going to be powered? We do not want to have billions of toxic Primary batteries in our landfills. These new intelligent devices will need to harvest surrounding ambient energy for life-of-product powering. This White Paper describes how new system architectures, energy harvesting technologies and safe rechargeable solid state batteries can be used to create high-efficiency energy harvesting-based systems.

Posted in: Electronics & Computers, White Papers

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Electronics Subracks: Requirements, Selection Criteria And Options For Adaptation

When selecting an electronics subrack, it is important to consider several factors, including application requirements and environmental conditions. Flexible product platforms, such as modular subracks, enable diverse configurations for various dimensions, static and dynamic loading levels such as shock and vibration resistance, electromagnetic interference shielding and individual internal mounting options.

Posted in: Electronics & Computers, White Papers

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How Lean Manufacturing Adds Value to PCB Production

In an earlier paper, we established the importance of Design for Manufacturing (DFM) in today’s PCB manufacturing environment. PCBs designed using those techniques typically experience reduced failure rates, cost less to manufacture, and minimize waste during production.

Posted in: Electronics & Computers, White Papers

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Dual-Leadframe Transient Liquid Phase Bonded Power Semiconductor Module Assembly and Bonding Process

This module package and bonding process enable device operation at temperatures exceeding 400 °C. A high-temperature-capable widebandgap semiconductor power module package, coupled with a new high-temperature- capable bonding process (with an optimized assembly and manufacturing process), has been developed that, together, can allow device operation at temperatures exceeding 400 °C, with the potential for higher-temperature operation depending on the semiconductor device characteristics. The semiconductor module is an ultracompact, hybrid power module that uses double leadframes and direct lead-frame-to- chip transient liquid phase (TLP) bonding. The unique advantages include very high current-carrying capability, low package parasitic impedance, low thermomechanical stress at high temperatures, double-side cooling, and modularity for easy system-level integration. The new power module will have a very small form factor with 3 to 5× reduction in size and weight from the prior art, no failure-prone bond wires, and will be capable of operating from 450 to –125 °C.

Posted in: Electronics & Computers, Semiconductors & ICs, Briefs

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Methods for Mitigating Space Radiation Effects, Fault Detection and Correction, and Processing Sensor Data

A combination of three innovations enables increased efficiency, stability, and flexibility of data management and systems functionality. The Integrated Modular Avionics (IMA) architecture being developed for space applications requires that sensor data be autonomously sampled and transmitted to the system network. This transmission needs to occur on a predetermined, fixed schedule to avoid conflicts on the network. It needs to be capable of building packets of sensor data for individual application partitions (i.e., environmental control, propulsion, and vehicle management). It must be easily configured for flexibility in system scheduling.

Posted in: Electronics & Computers, Briefs

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