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Dynamic Signal Analyzer

Data Translation (Marlboro, MA) announced the DT7837 ARM-based dynamic signal analyzer module for noise and vibration measurement. The computer portion of the module uses a ruggedized BeagleBone Black ARM processor. Complete source code is provided that can be modified and used without any restrictions. The front-end design allows simultaneous measurement of four 24-bit IEPE sensor inputs at a sampling rate of 102.4 kS/s. The module is used for precision measurements with microphones, accelerometers, and other transducers that have a large dynamic range. It also includes a 24-bit stimulus output, tachometer, general-purpose digital I/O, external trigger functions, and counter/timers. The ARM block processor includes BBB functions, FPGA, memory and support peripherals, interfaces for a USB host and client, Ethernet, power, and SD card.

Posted in: Products, Manufacturing & Prototyping, Test & Measurement

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Corrosion Detection

The ThermoCam LC (TCLC) from EVT Eye Vision Technology (Karlsruhe, Germany) detects surface defects such as cracks, pores, stripes, dents, and corrosion. The infrared camera detects corrosion that is invisible under the surface using the Impuls-Thermography method. The TCLC recognizes the defects as “hot spots.” A flash heats the surface, and the camera records the cooling of the material. Up to 100 images per second are delivered. The camera features noise (NETD) of 0.2 K, a measurement range from -50 to +300 °C, a field of view of 32 x 8 pixels, and opening angle of 40, 60, or 120°.

Posted in: Products, Manufacturing & Prototyping, Test & Measurement

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Voltage Meter

Dean Technology (Carrollton, TX) announced the HVM40B digital voltmeter for measurement of positive or negative voltages up to 40,000 Volts. It features an LED display, solid-state design, and dual-range measurement providing resolution below 20 kV. Other features include retractable feet, optional tilt handle, and optional rack-mount hardware. Input impedance of 10 giga-ohms minimizes circuit loading. It conforms to UL and CSA standards, and comes with various worldwide power cords.

Posted in: Products, Manufacturing & Prototyping, Test & Measurement

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Power Monitoring

Microchip Technology (Chandler, AZ) introduced the MCP39F511 single-phase power monitoring IC designed for real-time measurement of AC power. It is designed for use in high-performance commercial and industrial products such as lighting and heating systems, smart plugs, power meters, and AC/DC power supplies. To address industry requirements for better accuracy across current loads, additional power calculations, and event monitoring of various power conditions, the IC provides popular standard power calculations combined with advanced features. The import and export of active energy accumulation, four-quadrant reactive energy accumulation, zero-crossing detection, and dedicated PWM output have been integrated on-chip, along with the ability to measure active, reactive, and apparent power; RMS current and RMS voltage; line frequency; and power factor.

Posted in: Products, Manufacturing & Prototyping, Test & Measurement

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Accelerometers

PCB® Automotive Sensors Division (Depew, NY) offers MEMS DC response accelerometers for improving the precision of low-frequency vibration and motion in automotive applications. Available in full-scale ranges from ±2g to ±200g, the accelerometers come in single-axis (Series 3711E and Series 3741E) and triaxial (Series 3713E) configurations. The units include gas-damped, silicon MEMS sensing elements. Series 3711E and Series 3713E have a hermetically sealed titanium case, and Series 3741E units have a rugged anodized aluminum housing for harsh environments.

Posted in: Products, Manufacturing & Prototyping, Test & Measurement

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NASA Tests Asteroid Sampling Instrument

The first of five instruments for a spacecraft that will collect a sample from an asteroid and bring it back to Earth has arrived at Lockheed Martin for installation onto NASA’s Origins Spectral Interpretation Resource Identification Security-Regolith Explorer (OSIRIS-REx). The Thermal Emission Spectrometer (OTES) will conduct surveys to map mineral and chemical abundances and to take the asteroid Bennu’s temperature.Bolted to a cradle, the OSIRIS-REx TES is prepared for testing. A red lens cover nestles within the angular sunshade, keeping the optics clean. (ASU/Charles Leight)

Posted in: News, Aerospace, Instrumentation

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Quantitative Analysis of Failure Mode in Adhesively Bonded Test Specimens

A fluorescence visualization technique is used. Langley Research Center, Hampton, Virginia After adhesively bonded mechanical test specimens have been tested to failure, the failure mode must be interpreted and quantified. Areas of the adherent that are bare (no residual adhesive remains) have undergone adhesive failure. The remainder of the surface has undergone cohesive failure. The ability to distinguish and accurately quantify the relative amounts of cohesive and adhesive failure on a failed bonding surface is of tremendous importance in the field of mechanical testing, and for the development of bonded assemblies. Some adhesives (and adherents) are fluorescent, meaning they re-emit light at a different wavelength after being irradiated by some lighting source. This property allows for quantitative analysis of the adhesive failure mode (adhesive and cohesive). A digital image of the fluorescing adhesive or adherent can be analyzed and quantified using publicly available software to determine the relative areas of exposed and covered adherent surface.

Posted in: Briefs, TSP, Test & Measurement, Failure modes and effects analysis, Optics, Adhesives and sealants

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