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Time-to-Digital Converter

Mouser Electronics, Inc., (Mansfield, TX) is now stocking the TDC7201 time-to-digital converter from Texas Instruments (TI). The TDC7201 is designed for use with ultrasonic, laser, and radar range finding equipment using time-of-flight (TOF) technique. TI’s TDC7201 time-to-digital converter has two built-in time-to-digital converters (TDCs) that can be used to measure distance down to 4 cm and up to several kilometers using a simple architecture. The TDC7201 features a wide measurement range of 0.25 ns to 8 ms and high accuracy of 28 ps. The device has a single shot resolution of 55 ps, (equivalent to 0.825 cm).

Posted in: Products, Products, Data Acquisition, Measuring Instruments

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Single Photon Counting Module

Excelitas Technologies® (Waltham, MA) has introduced SPCM-NIR, a Single Photon Counting Module specifically selected and performance-optimized for the near-infrared (NIR) wavelength spectrum. This NIR-spectrum enhanced device is designed to support long-range LIDAR, quantum communication and microscopy applications. The Excelitas SPCM-NIR uses a specially selected silicon avalanche photodiode (SLiK) with peak single photon detection efficiency (PDE) at 780nm, typically better than 73%, while maintaining uniformity over a 180 μm diameter active area.

Posted in: Products, Products, Data Acquisition, Measuring Instruments

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Products of Tomorrow: November 2016

The technologies NASA develops don’t just blast off into space. They also improve our lives here on Earth. Life-saving search-and-rescue tools, implantable medical devices, advances in commercial aircraft safety, increased accuracy in weather forecasting, and the miniature cameras in our cellphones are just some of the examples of NASA-developed technology used in products today.

Posted in: Products, Solar Power, Manufacturing & Prototyping, Sensors, Test & Measurement

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Temperature Monitors

Measurement Computing, Norton, MA, offers the TC-32 and TC-32- EXP temperature monitors for thermocouple (TC) measurement. Providing both Ethernet and USB ports, the TC- 32 provides 32 channels of 24-bit resolution for medium channel installations, and the TC-32-EXP adds 32 high-precision channels to support larger installations. They feature sigma-delta 24-bit ADCs, differential inputs, TC-to-host isolation, and cold-junction compensation (CJC) for each channel.

Posted in: Products, Manufacturing & Prototyping, Monitoring, Test & Measurement

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Oscilloscopes

Teledyne LeCroy, Chestnut Ridge, NY, introduced HDO9000 high-definition oscilloscopes with HD1024 high-definition technology. Features include OneTouch user interface, 15.4" capacitive touchscreen, 10- bit resolution, bandwidths of 1 GHz to 4 GHz, and sample rates of 40 GS/s. Users can perform all common operations with a touch of the display.

Posted in: Products, Manufacturing & Prototyping, Test & Measurement

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Semiconductor Test System

Marvin Test Solutions, Irvine, CA, released the TS-960e PXI Express semiconductor test platform that features test capabilities for RF devices and SoC applications. It features 256 125-MHz digital I/O channels with per-pin-PMU, and multiple RF and analog test instruments in a single, 21-slot PXIe chassis. It incorporates the GX5296 digital subsystem, software test suite, and RF instrumentation option.

Posted in: Products, Manufacturing & Prototyping, Semiconductors & ICs, Test & Measurement

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Load Frame

To facilitate materials testing on the mesoscale, Psylotech, Evanston, IL, offers the TS™ modular platform that validates material models across 6 orders of magnitude of force and length scales. Users can discern NIST-traceable stress and strain readings ranging from soft tissue to macro-scale composite layups. Force capacities are available from 100N to 10kN, with a local displacement sensor to minimize measured compliance and verify global specimen strain.

Posted in: Products, Manufacturing & Prototyping, Test & Measurement

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