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This work outlines the present state-of-the-art in terms of on-wafer S-parameter measurements, on-wafer
noise figure measurements, and on-wafer power measurements up to 350 GHz for a variety of MMIC and new Submillimeter-wave MMIC (S-MMICs) chips.
This device moves computational, sensing, and actuation abilities closer to the source, allows for the networking of multiple like nodes to each other and to a central processor, and can do so using nothing more than the already in-situ power wiring of the system.