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Jan 2008

Improved Thermal Stability of Copper Vias Using a Cyclical Stress Test†

Via stress migration (VSM) occurs when the relaxation of thermal stresses in copper interconnects causes defects to form under a via [1]. Tests for this phenomenon usually involve measurements of the change in via resistance after an extended bake of 100 to 1000 hours at fixed temperature. The long cycle time for VSM testing delays the feedback loop for process optimization. ...
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