Nasa Tech Briefs - Manufacturing & Prototyping

NASA Tech Briefs’ Manufacturing & Prototyping Web page spotlights advances in manufacturing and fabrication processes, rapid prototyping, and digital prototyping, as published in NASA Tech Briefs magazine. Many of the Tech Briefs below are correlated to a Technical Support Package (TSP) or White Paper that can be downloaded free of charge.

Jun 2009

Two-Step Plasma Process for Cleaning Indium Bonding Bumps

This process could increase yields in the manufacture of consumer electronic products.

A two-step plasma process has been developed as a means of removing surface oxide layers from indium bumps used in flip-chip hybridization (bump bonding) of integrated circuits. This process has considerable commercial potential in that flip-chip ...
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Tool for Crimping Flexible Circuit Leads

A hand tool has been developed for crimping leads in flexible tails that are parts of some electronic circuits — especially some sensor circuits. The tool is used to cut the tails to desired lengths and attach solder tabs to the leads. For tailoring small numbers of circuits for special applications, ...
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Improved Assembly for Gas Shielding During Welding or Brazing

Inert gas is distributed evenly over the region surrounding the weld joint.

An improved assembly for inert-gas shielding of a metallic joint is designed to be useable during any of a variety of both laser-based and traditional welding and brazing processes. The basic purpose of this assembly or ...
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