Electronic Components

3D Printing with Copper and Gold Achieved

A team of scientists from the University of Twente in The Netherlands has discovered a way to 3D print structures of copper and gold, by stacking microscopically small metal droplets. These droplets are made by melting a thin metal film using a pulsed laser. They say that this technology would allow manufacturing of entirely new devices and components.

Posted in: MDB, News, Electronic Components, Electronics, Rapid Prototyping & Tooling, Materials, Metals, Medical, Patient Monitoring

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Heart-Powered Electronics

Researchers at the University of Illinois at Urbana-Champaign have created thin, flexible electronic devices that efficiently harvest the mechanical energy from natural motions of the human body. In addition to advances in materials processing to enable fabrication of these thin film devices, accurate analytical models were developed to predict electrical output of mechanical energy harvesting devices as a function of key design parameters and materials properties.

Posted in: MDB, News, Electronic Components, Electronics, Power Supplies, Coatings & Adhesives, Composites, Materials, Metals, Plastics, Implants & Prosthetics, Medical

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Fundamentals of Heat Pipes: Theory, Design Applications

With increased power requirements and reducing packaging size, thermal management is critical for to ensure optimum performance of key electronics in military, medical and other commercial applications. Heat Pipes, which are ‘super conductors’ of heat, are now being more frequently utilized to solve these challenging heat issues. Although heat pipes have been around for decades, many new applications for them continue to emerge.

Posted in: On-Demand Webinars, Electronic Components, Electronics

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Reducing Interconnection Weight in Autosports

In Formula 1 and other autosports, weight reduction is critical to competitive advantage. A few grams saved here and a few more saved there can add up to significant savings. There is also a move toward high-density packaging of electronics parts. As the electronics content of cars increases, the natural drive is to miniaturize the package to gain maximum efficiency in the use of space.

Posted in: Articles, Electronic Components, Electronics, Composites, Fiber Optics

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0T Series – Watertight Connector

LEMO USA, Inc., Rohnert Park, CA, introduces the 0T Series Connector, a small sized watertight connector using the same original LEMO Push-Pull technology. Based on the LEMO B Series, the 0T Series Connector includes a special construction with an inner sleeve and extra sealing to enable IP68 water protection. The 0T Series is available in 2- to 9-contact configurations. Contacts can be terminated by soldering to the wire, crimping onto the wire, or directly to a PCB. For Free Info, Visit http://info.hotims.com/55588-175

Posted in: MDB, Products, Electronic Components, Electronics, Power Management, Power Supplies, Manufacturing & Prototyping, Medical

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International Power Cords and Cord Sets

Qualtek, Mentor, OH, announces that it now fully stocks a comprehensive selection of 2- and 3-conductor North American power cords, international power cords, and hospital-grade power cords in various configurations. A wide selection of plugs and connectors are available with various cable jackets including outdoor rated, colors, temperature rating, lengths, and shielding. Custom configurations, value added termination, and strain reliefs are available upon request. For Free Info, Visit http://info.hotims.com/55588-176

Posted in: MDB, Products, Electronic Components, Electronics, Power Management, Power Supplies, Manufacturing & Prototyping, Medical

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Capacitively Coupled, High-Voltage Current Sensing for Extreme Environments

NASA’s Jet Propulsion Laboratory, Pasadena, California Wide-temperature and extreme-environment electronics are crucial to future missions. These missions will not have the weight and power budget for heavy harnesses and large, inefficient warm boxes. In addition, extreme-environment electronics, by their inherent nature, allow operation next to sensors in the ambient environment, reducing noise and improving precision over the warm-box-based systems employed today.

Posted in: Briefs, TSP, Electronic Components, Electronics & Computers, Power Supplies, Thermal Management, Sensors

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