Electronic Components
Automated Break-Out Box for Use with Low-Cost Spacecraft Integration and Test
Posted in Briefs, TSP, Electronic Components on Tuesday, 01 December 2015
Goddard Space Flight Center, Greenbelt, Maryland Electrical checkout and testing is a critical part of the overall space integration and test flow. Verifying proper harness and connector signal interfaces is key to ensuring component health and overall system functionality. Break-out boxes (BOBs) are used to give test personnel access to electrical signals for probing, voltage injection, isolation checks, safe-to-mate checks, and voltage/current measurements, and comparing to expected results. Currently, this involves manually attaching multimeters and oscilloscopes to banana jacks on the BOB, taking measurements, and comparing to expected results.
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Radiation-Hardened 10BASE-T Ethernet Physical Interface (PHY)
Posted in Briefs, TSP, Electronic Components on Tuesday, 01 December 2015
Goddard Space Flight Center, Greenbelt, Maryland The EXPRESS Logistics Carrier (ELC) system was built by NASA Goddard for installation on the International Space Station (ISS). Four ELC systems are on ISS. Each ELC site includes two data nodes. The ELC requirements call for a radiation-hardened 10BASE-T Ethernet interface at each data node. The requirement for ELC was to support a full receive version of the interface, and only to provide a link pulse to the attached payloads on the transmit side of the interface. Further development required a full duplex version of a radiation-hardened 10BASE-T Ethernet interface to support the SpaceCube program.
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Radiation-Hardened, Quad 12-Bit Digital-to-Analog Converter ASIC
Posted in Briefs, TSP, Electronic Components on Tuesday, 01 December 2015
This circuit incorporates science-driven features based on applications in a realistic space environment. Goddard Space Flight Center, Greenbelt, Maryland This radiation-hardened, compact, low-power, quad 12-bit digital-to-analog converter (DAC) application specific integrated circuit (ASIC) incorporates science-driven features based on applications in a realistic space environment such as threshold setting, current bias circuits, and general-purpose DC voltage generation. It is based on a previous 10-bit DAC that exhibited excellent test results, presenting the possibility of a 12-bit design.
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Automated Generation of Failure Modes and Effects Document from a Simple SysML Model
Posted in Briefs, TSP, Electronic Components on Tuesday, 01 December 2015
NASA’s Jet Propulsion Laboratory, Pasadena, California This software queries a model of system in the MagicDraw program and uses that information to create an Excel spreadsheet that represents a basic FMEA (Failure Modes and Effects Analysis). It automates the generation of an FMEA; the user only has to open MagicDraw, then run this plugin to produce an Excel spreadsheet.
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Space Network Access System (SNAS)
Posted in Briefs, TSP, Electronic Components on Tuesday, 01 December 2015
Goddard Space Flight Center, Greenbelt, Maryland SNAS is a single, universally accessible, standards-based, full-featured customer interface for performing Tracking and Data Relay Satellite System (TDRSS) planning, scheduling, and real-time service monitoring and control. It consolidates functionality of multiple legacy customer interface systems into a single system, and is the primary access system for managing TDRSS resources.
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Creating Stretchy Conductors for Flexible Electronics
Posted in News, Electronic Components, Electronics, Diagnostics, Patient Monitoring on Wednesday, 09 September 2015
A team of engineers at Washington State University, Pullman, discovered how to stretch metal films used in flexible electronics to twice their size without breaking, which they say, could lead to dramatic improvements in flexible electronics. This may advance applications in bendable batteries, robotic skins, wearable monitoring devices and sensors, and connected fabrics.
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DoD Pushes for Wearable Electronics
Posted in News, Electronic Components, Electronics, Patient Monitoring on Tuesday, 08 September 2015
As part of a Department of Defense effort to partner with industry and academia to ensure that the US continues to lead in the new frontiers of manufacturing, Secretary of Defense Ash Carter announced that the Obama administration will award a Manufacturing Innovation Institute for Flexible Hybrid Electronics to a consortium of 162 companies, universities, and non-profits led by the FlexTech Alliance.
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