Electronics
Assisting An Aging Population: Designing Medical Devices With Force Sensing Technology
Posted in White Papers, White Papers, Electronics on Tuesday, 23 June 2015
With the geriatric population on the rise, design engineers are challenged with designing responsive, noninvasive, user-friendly medical devices that cater to the needs of an older generation. Patients are looking for cost-effective, easy to use assistive tools that help them regain independence and confidence in their everyday life. Force feedback is a key feature for many of these devices that provide the user and doctor with great insight that ultimately results in better quality of life for the patient. Medical devices with force feedback allow design engineers to create innovative products that differentiate them from the competition. 
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3D Printing with Copper and Gold Achieved
Posted in News, Electronic Components, Electronics, Rapid Prototyping & Tooling, Metals, Patient Monitoring on Thursday, 18 June 2015
A team of scientists from the University of Twente in The Netherlands has discovered a way to 3D print structures of copper and gold, by stacking microscopically small metal droplets. These droplets are made by melting a thin metal film using a pulsed laser. They say that this technology would allow manufacturing of entirely new devices and components.
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Heart-Powered Electronics
Posted in News, Electronic Components, Electronics, Power Supplies, Coatings & Adhesives, Composites, Metals, Plastics, Implants & Prosthetics on Wednesday, 17 June 2015
Researchers at the University of Illinois at Urbana-Champaign have created thin, flexible electronic devices that efficiently harvest the mechanical energy from natural motions of the human body. In addition to advances in materials processing to enable fabrication of these thin film devices, accurate analytical models were developed to predict electrical output of mechanical energy harvesting devices as a function of key design parameters and materials properties.
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Fundamentals of Heat Pipes: Theory, Design Applications
Posted in On-Demand Webinars, Electronic Components, Electronics on Thursday, 14 May 2015
With increased power requirements and reducing packaging size, thermal management is critical for to ensure optimum performance of key electronics in military, medical and other commercial applications. Heat Pipes, which are ‘super conductors’ of heat, are now being more frequently utilized to solve these challenging heat issues. Although heat pipes have been around for decades, many new applications for them continue to emerge.
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New Fabrication Technique Prints Silicon on Paper
Posted in News, Electronics, Diagnostics, Patient Monitoring, Lasers & Laser Systems, Sensors on Tuesday, 21 April 2015
Using a single laser pulse, a group of researchers at Delft University of Technology in The Netherlands has devised a method that allows silicon, in the polycrystalline form used in circuitry, to be produced directly on a paper substrate from liquid silicon ink. The process can be expanded to create biomedical sensors and stretchable electronics.
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External Power Supply Efficiency Regulation Introduction
Posted in White Papers, Electronics on Thursday, 16 April 2015
Presently Energy Efficiency Level V is mandatory in Canada and throughout Europe. In February 2016 Energy Efficiency Level VI will become mandatory in the United States. Attached are the details of the pending change, but in brief, both the standby power draw and efficiency of the operating power supplies must meet minimum levels set in the standard. MEGA is in the process of updating our product line to comply with the coming changes.
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Reducing Interconnection Weight in Autosports
Posted in Articles, Electronic Components, Electronics, Composites, Fiber Optics on Wednesday, 01 April 2015
In Formula 1 and other autosports, weight reduction is critical to competitive advantage. A few grams saved here and a few more saved there can add up to significant savings. There is also a move toward high-density packaging of electronics parts. As the electronics content of cars increases, the natural drive is to miniaturize the package to gain maximum efficiency in the use of space.
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