Deployable Antenna Circuit Board Material Design and Fabrication Process
Posted in Briefs, TSP, Electronics on Monday, 29 February 2016
This technology has applications in solar arrays for small satellites. NASA’s Jet Propulsion Laboratory, Pasadena, California The Integrated Solar Array and Reflectarray (ISARA) antenna requires a rugged circuit board material that will meet the following requirements: (1) remains sufficiently flat over the required operating temperature range with solar cells mounted, and under full solar illumination, including heat dissipation due to ≈30% efficiency solar cells; (2) provides a sufficiently high-quality RF-grade circuit board material needed to print the reflectarray antenna; (3) is sufficiently thin (<2.5 mm) to fit within the available stowage volume; and (4) has low mass density (≈5 kg/m2).
Implementing High Density Embedded Computing (HDEC) Solutions
Posted in White Papers, Electronics, Electronics & Computers on Friday, 26 February 2016
High Density Embedded Computing solutions are solving large data throughput needs in signals intelligence, ground control, and homeland security applications. This guide focuses on how to efficiently implement these technologies including the expanded availability of native PCI Express 3.0 interfaces.
Full-Wave Matching Circuit Optimization Shortens Design Iterations
Posted in White Papers, Electronics, Electronics & Computers on Wednesday, 24 February 2016
Full-wave matching circuit optimization (FW-MCO) is a new technology introduced by Remcom, which combines full wave 3D EM simulation and circuit optimization to solve an age-old RF problem:
determining which component values provide the desired match for a given matching network layout.
Stencil-less Jet Printing for PCB Assembly
Posted in White Papers, Electronics on Thursday, 11 February 2016
Imagineering, Inc. introduces stencil-less Jet Printing to facilitate quick turn around Printed Circuit Board Assembly.
Full RF Signal Chains from 0 Hz to 110 GHz
Posted in White Papers, Electronics, Data Acquisition, Sensors on Thursday, 11 February 2016
Analog Devices (ADI) has expanded its RF capabilities in the full signal chain, including companion products, in the full bandwidth from 0 Hz to 110 GHz.This white paper provides examples of the wider frequency spectrum covered by ADI, and explains that true DC is important. Off signal chain performance is also critical, and this paper shows how low-noise, high-stability control and power components are important to overall RF signal performance.
Microelectronics Package for Extreme Environments
Posted in White Papers, White Papers, Electronics on Monday, 01 February 2016
Anaren’s MSK Products Division designed, built, and tested a high-temperature, co-fired ceramic (HTCC) electronics package for use in oil and gas drilling that proved Anaren’s ability to push the boundaries for developing microelectronics packages to survive in difficult high-temperature environments.
Basics of Electric Heaters
Posted in White Papers, White Papers, Electronics on Friday, 29 January 2016
Hotwatt has manufactured specialized electric heating elements for over 64 years, all made in the USA. Products include cartridge, air process, immersion, strip and finned strip, tubular and finned tubular, band, compressor crankcase, foil, flexible rope and ceramic heaters. We are a quality supplier to OEM's in the in industrial, medical, commercial appliance, packaging, instrumentation, aviation, transportation and military fields.

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