Electronics
Successful Test Management For Systems Engineers
Posted in White Papers, White Papers, Electronics on Monday, 07 December 2015
Designing a reliable test strategy requires broad, strategic thinking. The goal of verification is to ensure you release a best-quality system that meets customer expectations as documented in your early design concept and requirements gathering phases. To maximize the value of your test process, test your product objectives early.
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Delivering Roadworthy Designs: Automotive Electronics Circuit Protection Overview, Applications & Standards
Posted in White Papers, Electronics on Friday, 04 December 2015
Today’s automotive designs include nearly 100 microprocessors; that number is expected to double in five years. From in-dash displays to connected technologies and safety systems, all onboard electronics require circuit protection to maintain reliability. The major sources of electrical hazards in automotive systems are electrostatic discharge (ESD), switching loads in power electronics circuits, and lightning. Overcoming transient surges that can harm the vehicle’s electronics, whether under the hood or in the cabin, is one of the biggest obstacles of system design.
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IEEE Advances Standards and Works to Expand Interoperable eHealth Communications
Posted in News, Electronics, Diagnostics, FDA Compliance/Regulatory Affairs, Patient Monitoring on Wednesday, 11 November 2015
IEEE, Piscataway, NJ, has announced a new standard and two new standards development projects designed to support plug-and-play, interoperable communications across eHealth devices. The new eHealth standard is IEEE 2410™-2015, Biometrics Open Protocol Standard, intended to support continuous protection of biometric data by providing identity assertion, role gathering, multi-level access control, assurance and auditing.
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Multi-Gb/s Fiberoptic Bus for Spacecraft
Posted in Tech Briefs, Electronics, Photonics on Saturday, 31 October 2015
A fiberoptic bus offers a number of advantages over conventional copper buses. NASA’s Jet Propulsion Laboratory, Pasadena, California A fiberoptic bus interconnect for spacecraft with multi-Gb/s data rate capacity is designed to provide seamless coordinated control and data exchange at typical intra-spacecraft distances. The system is composed of a physical layer and associated firmware for implementing a ring bus communication protocol and a switch-based RapidIO communication protocol.
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2015 Create the Future Design Contest: Electronics Category Winner
Posted in Articles, Electronics on Saturday, 31 October 2015
Real-Time Fiber Optic Sensing System Lance Richards
NASA Armstrong Flight Research Center
Edwards, CA A team at NASA Armstrong has developed fiber optic sensing system (FOSS) technology that represents a major breakthrough in high-speed operational monitoring and sensing. Driven by ultra-efficient algorithms, FOSS can be used to determine, in real time, a variety of critical parameters including strain, shape deformation, temperature, liquid level, and operational loads. This state-of-the-art sensor system delivers reliable measurements in the most demanding environments confronted by aerospace, automotive, and energy sectors. FOSS is ideal for monitoring the structural health of aircraft, buildings, and dams; improving the efficiency of turbines and industrial equipment; and detecting instabilities within tunnels and power plants.
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Traceability Best Practices for Systems Engineers
Posted in White Papers, Electronics on Wednesday, 14 October 2015
Serious situations: In the middle of a project, your best customer changes a high-level business requirement. How will this change impact the system spec your engineers are working on right now? How will it impact scope for the upcoming release?
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Electronic Component Testing: A Non-contact Sport
Posted in White Papers, Electronics, Cameras on Thursday, 10 September 2015
As electronic circuit boards and components get smaller and more powerful, inherent heat can cause significant damage. Infrared thermography can identify hot spots, allowing for improved thermal management and greater advances in circuit board design.
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