Electronics

Tech Trend Report: Will GaN Knock out Silicon Semiconductors?

This whitepaper is the first in a series from Intercomp, a premier electronics component parts distributor with value analysis/value engineering services designed to help companies with product innovations, development, sourcing and quality management.

Posted in: White Papers, Electronics, Electronics & Computers

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Fundamentals of Heat Pipes: Theory, Design Applications

With increased power requirements and reducing packaging size, thermal management is critical for to ensure optimum performance of key electronics in military, medical and other commercial applications. Heat Pipes, which are ‘super conductors’ of heat, are now being more frequently utilized to solve these challenging heat issues. Although heat pipes have been around for decades, many new applications for them continue to emerge.

Posted in: On-Demand Webinars, Electronic Components, Electronics

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External Power Supply Efficiency Regulation Introduction

Presently Energy Efficiency Level V is mandatory in Canada and throughout Europe. In February 2016 Energy Efficiency Level VI will become mandatory in the United States. Attached are the details of the pending change, but in brief, both the standby power draw and efficiency of the operating power supplies must meet minimum levels set in the standard. MEGA is in the process of updating our product line to comply with the coming changes.

Posted in: White Papers, Electronics, Electronics & Computers

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Linear Motors

Heidenhain (Schaumburg, IL) offers ETEL ILF and ILM series ironless high-speed linear motors for use in the semiconductor and electronics industry. The motors utilize an ironfree coil design for zero-attraction force between the carriage and the magnetic way. The ILF is a smallersized motor for very high dynamic and low-moving mass applications; the ILM is a more powerful version of the ILF, and has an option to be air-cooled to increase continuous force output. The ironless motors come in a variety of lengths and heights with different degrees of force, and share the same profile so that one is interchangeable with the other. The motors can reach speeds of up to 20 m/s and peak force of up to 2,500 N. They are designed for direct drive applications and offer no backlash, fewer parts, and require no maintenance. For Free Info Visit http://info.hotims.com/55588-304

Posted in: Products, Electronics, Manufacturing & Prototyping, Motion Control, Motors & Drives, Semiconductors & ICs

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Reducing Interconnection Weight in Autosports

In Formula 1 and other autosports, weight reduction is critical to competitive advantage. A few grams saved here and a few more saved there can add up to significant savings. There is also a move toward high-density packaging of electronics parts. As the electronics content of cars increases, the natural drive is to miniaturize the package to gain maximum efficiency in the use of space.

Posted in: Articles, Electronic Components, Electronics, Composites, Fiber Optics

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Magnetic Fluids Deliver Better Speaker Sound Quality

NASA’s liquid magnetization technology helps Sony increase sound amplitude while reducing distortion. In the early 1960s, NASA scientists were trying to move fuel into an engine without the benefit of gravity. A scientist at Lewis Research Center (now Glenn Research Center) came up with the idea to magnetize the liquid with extremely fine particles of iron oxide. That way, fuel could be drawn into the engine using magnetic force.

Posted in: Articles, Spinoff, Electronics, Joining & Assembly

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Self-Powered Intelligent Keyboard Could Provide Additional Security

By analyzing such parameters as the force applied by key presses and the time interval between them, a new self-powered, non-mechanical, intelligent keyboard could provide a stronger layer of security for computer users. The self-powered device generates electricity when a user’s fingertips contact the multi-layer plastic materials that make up the device.

Posted in: News, Board-Level Electronics, Computers, Electronic Components, Electronics, Electronics & Computers, Power Management, Energy, Energy Harvesting, Semiconductors & ICs

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White Papers

Silicones Meet the Needs of the Electronics Industry
Sponsored by Master Bond
Evaluating Electrically Insulating Epoxies
Sponsored by Master Bond
Implementing High Density Embedded Computing (HDEC) Solutions
Sponsored by Trenton Systems
Integrated Epoxy Feedthroughs Improve Fuel Pump Reliability
Sponsored by Douglas Electrical Components
Hermetic Feedthroughs Safeguard Mission-Critical Electronics
Sponsored by Douglas Electrical Components
Adhesion Reduction of Semiconductor Dicing Tape
Sponsored by Excelitas

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