Electrical/Electronics

Wire Bonding to Pads in Tilted Planes

This technique can be used in industries where devices need to be made smaller and lighter, such as medical, aerospace, automotive, and military. NASA’s Jet Propulsion Laboratory, Pasadena, California Scientific imaging arrays need to have their individual imaging elements arranged in a close-spaced mosaic. The typical single imaging element is a silicon chip mounted on a larger support frame. This excess area of the support frame takes away valuable imaging space from the mosaic. This appears as a grid of black (no data) in the overall mosaic image. Making the support frame smaller makes the amount of lost data smaller, and the imaging elements can be spaced more closely together. Eliminating the support frame altogether brings the imaging elements even closer. This is referred to as four-side buttable.

Posted in: Briefs, TSP

Read More >>

cFE/CFS Evolution for Multicore Platforms

Goddard Space Flight Center, Greenbelt, Maryland This effort ports the Core Flight Executive (cFE)/Core Flight System (CFS) flight software architecture to multicore processor platforms, and provides mission developers with a common, flightready, flexible software environment that supports single, multi-processor, and multicore systems. Currently the cFE/CFS only supports single-core processors.

Posted in: Briefs, TSP

Read More >>

Hermetic Feedthroughs for Mission-Critical Electronics

Sealed cavities are important in applications such as power electronics for missiles aboard ships or on high-altitude flights; automotive charging stations; and high-voltage power generation. Douglas Electrical Components, Randolph, New Jersey One of the most common causes of electronics failure is moisture. Because water and electronics do not mix well, several strategies exist to protect mission-critical components from moisture and condensation. One of the most successful methods involves hermetically sealed electronics cavities enabled by moisture-blocking component assemblies such as hermetic feedthrough technology.

Posted in: Briefs

Read More >>

Microelectronics Package for Extreme Environments

Anaren’s MSK Products Division designed, built, and tested a high-temperature, co-fired ceramic (HTCC) electronics package for use in oil and gas drilling that proved Anaren’s ability to push the boundaries for developing microelectronics packages to survive in difficult high-temperature environments.

Posted in: White Papers, White Papers, Electronics

Read More >>

Basics of Electric Heaters

Hotwatt has manufactured specialized electric heating elements for over 64 years, all made in the USA. Products include cartridge, air process, immersion, strip and finned strip, tubular and finned tubular, band, compressor crankcase, foil, flexible rope and ceramic heaters. We are a quality supplier to OEM's in the in industrial, medical, commercial appliance, packaging, instrumentation, aviation, transportation and military fields.

Posted in: White Papers, White Papers, Electronics

Read More >>

Selecting the Right Vent to Extend the Lifetime of Electronic Components in Vehicles

Electronic components are rapidly replacing mechanical parts in automobiles. Suppliers must protect these electronic components from harsh contaminants and temperature fluctuations, to ensure reliable performance. Selecting the right venting solution can help to extend the life of the electronic component.

Posted in: White Papers, Electronic Components

Read More >>

RF & MW Control Products in Silicon

Analog Devices’ new RF and microwave (MW) switch and attenuator products implemented in advanced silicon process benefit inherent advantages of silicon technology compared to legacy counterparts using gallium-arsenide (GaAs). This paper provides highlights on features and key performance parameters of the new switch and attenuator products.

Posted in: White Papers, Data Acquisition, Sensors

Read More >>

The U.S. Government does not endorse any commercial product, process, or activity identified on this web site.