Electrical/Electronics

Novel Computer Chips Could Bridge Gap Between Computation and Storage

Software written by Jing Li, right, and her students — including Jialiang Zhang, left —allows programmers to directly use existing coding languages with the new Liquid Silicon chips. (Credit: Stephanie Precourt/UW–Madison College of Engineering) Computer chips in development at the University of Wisconsin–Madison could make future computers more efficient and powerful by combining tasks usually kept separate by design. Jing Li, an assistant professor of electrical and computer engineering at UW–Madison, is creating computer chips that can be configured to perform complex calculations and store massive amounts of information within the same integrated unit — and communicate efficiently with other chips. She calls them “liquid silicon.”

Posted in: News, Computers, Electronic Components, Electronics, Semiconductors & ICs

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Supersonic Spray Yields New Nanomaterial for Bendable, Wearable Electronics

Left, photograph of a large-scale silver nanowire-coated flexible film. Right, silver nanowire particles viewed under the microscope. (Credit: S.K. Yoon, Korea University) A new, ultrathin film that is both transparent and highly conductive to electric current has been produced by a cheap and simple method devised by an international team of nanomaterials researchers from the University of Illinois at Chicago and Korea University. The film is also bendable and stretchable, offering potential applications in roll-up touchscreen displays, wearable electronics, flexible solar cells and electronic skin.

Posted in: News, Electronics, Electronics & Computers, Materials, Sensors, Transducers

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Integration and Operational Guidelines for MEMS-Based Inertial Systems: Application that includes Magnetometers

A high performance inertial system that includes magnetometers can provide accurate platform heading information in a variety of applications and operational environments. However, performance depends greatly on where the inertial system is installed within the application. In our white paper, you’ll learn integration guidelines for inertial systems and operational compensation considerations. It includes information on:

Posted in: White Papers, Aeronautics, Electronics & Computers, Data Acquisition, Sensors

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SWaP-C and Why Your Component Partner Matters

The military is continually pushing to decrease the size, weight, power and cost (SWaP-C) of its electronics, particularly for items carried by the troops. To meet these goals, everyone involved in designing and manufacturing the device needs to work together closely to ensure maximum efficiency of every component. This makes choosing the right partner crucial. Our white paper explores why SWaP-C is so important and includes information on:

Posted in: White Papers, Aeronautics, Defense, Electronics, Manufacturing & Prototyping

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Enabling Small-Form-Factor, High-Capacity Small-Cell Platforms

There are about eight billion people who use cellphones to communicate, access social media, and upload and download videos and other content. This insatiable demand for connectivity and data will continue to increase. By 2020, and beyond, there could be a 1,000x increase in mobile data, which outpaces today's technology network capacity. The communication industry must determine how to scale networks to accommodate the increase in bandwidth demand for better security, power efficiency, reduced latency, and lower total cost of ownership. This paper discusses the options available to increase network capacity.

Posted in: White Papers, Communications, Electronics & Computers

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Combating Driver Fatigue with Mobile Surveillance

Driver fatigue is a leading cause of traffic accidents for heavy-duty vehicles such as mining trucks, excavators, bulldozers, cranes, cargo trucks, and buses. Their drivers need a rapid alert system to keep them awake and on the road. Find out about an in-vehicle surveillance platform that uses a camera to monitor drivers for fatigue, analyzing video in real-time to activate alerts and wireless communications.

Posted in: White Papers, Automotive, Communications, Electronics & Computers, Cameras, Displays/Monitors/HMIs

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Sandia, Harvard Team Create First Quantum Computer Bridge

This stylized illustration of a quantum bridge shows an array of holes etched in diamond with two silicon atoms placed between the holes. (Illustration courtesy of Sandia National Laboratories) By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.

Posted in: News, Computers, Electronic Components, Electronics, Electronics & Computers

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