Electrical/Electronics

The Ins and Outs of Spaceflight Passive Components and Assemblies

RF and microwave components deployed in space flight applications can experience hundreds of degrees of temperature variation, massive amounts of radiation, and can be expected to operate at an elevated level for sometimes decades. The demands of operating in a space environment bring many unique challenges and unforgiving reliability requirements; therefore, designing passive components to meet these rigorous operation criteria necessitates a high level of design expertise, qualifications/certifications, and testing capability.

Posted in: White Papers, White Papers, Aerospace, Defense, Electronics & Computers, RF & Microwave Electronics
Read More >>

Overcome Connected Car Design and Test Challenges

Today, radar systems, such as adaptive cruise control, stop-and-go, blind spot detection, lane change assist, and rear crash warning, are being developed and integrated into automobiles to reduce possible collisions and prevent human casualties. Engineers are choosing the SystemVue Scenario Framework solution to increase design fidelity and save costs during design and test. Learn more by downloading the application note, Automotive FMCW Radar System Design Using 3D Framework for Scenario Modeling.

Posted in: White Papers, Automotive, Electronics & Computers, Test & Measurement
Read More >>

Modern Measurement Tools Information at Your Fingertips

It takes the right tools to perform a job well, so having the right set of test instruments and software on your bench is critical to ensuring your design meets all its requirements. It also takes having the right information available to you when you need it. Keysight Technologies has both a comprehensive library of information, and the broadest portfolio of bench solutions, fully equipped with capability that will safeguard you from overlooking critical measurements and analysis that could cause your end-product to fail in its intended market. So, whether your needs include understanding the power consumption of your device, providing clean dc and ac power, component characterizing, data acquisition, analyzing digital designs, software to automate your tests, or generating/visualizing waveforms, Keysight has essential bench solutions for your needs. Get the most benefit from your Keysight instruments with application notes, tips, product information and more – right at your fingertips.

Get your measurement resources

Posted in: White Papers, Electronics & Computers, Test & Measurement
Read More >>

Printed Electronics Primer: an Introduction to the Basics of Printed Electronics

This white paper provides an overview of how printed electronics (PE) can help you fit more functionality into smaller spaces, while maximizing cost efficiency. You will learn the basic terminology and gain an understanding of today’s PE industry, including prevalent technologies, materials and manufacturing processes.

Posted in: White Papers, Communications, Electronics & Computers, Medical
Read More >>

Recovering Metals from Electronic Waste

This process dissolves the major metals found in electronics, including materials that have been shredded, magnetically separated, or milled to a particle size less than one millimeter.

End-of-life electronic devices such as smartphones, computers, televisions, and other electronics contain significant amounts of valuable metals including base metals (zinc, tin, lead, nickel, and copper), precious metals (silver, gold, and palladium), and rare earth magnets (neodymium, yttrium, samarium). Some electronic scrap is currently landfilled or incinerated, and there is a need to develop more effective processes to capture these valuable metals along with keeping them out of the environment.

Posted in: Briefs, Electronics & Computers
Read More >>

Solder Bond Packaging for High-Voltage Pulsed Power Devices

This invention is a superior switching component for pulsed power applications.

The huge demand for switching components exceeding silicon's (Si) current density limitation of 200 A/cm2 has pushed the enhancement of alternative semiconductor materials such as silicon carbide (SiC), gallium nitride, and diamond. The enhanced material properties of SiC, such as high thermal conductivity, large critical field, wide bandgap, large elastic modulus, and high saturation velocity, make it a viable candidate for pulsed power systems. Using SiC would increase both current and power densities, improve dI/dt and dV/dt capabilities, reduce recovery time, and minimize switching losses in various power electronic systems. Furthermore, a significant reduction in the volume and weight of pulsed power systems can be realized by implementing SiC SGTOs, reducing the thermal management requirements of the pulsed power system.

Posted in: Briefs, Electronics & Computers
Read More >>

Chip-Sized Terahertz Modulator for Faster Data Transmission

This modulator is suitable for THz transmitters/receivers on a single chip.

Tufts University engineers have invented a chip-sized, high-speed modulator that operates at terahertz (THz) frequencies at room temperature and at low voltages without consuming DC power. The discovery could transmit data at significantly higher speeds than currently possible.

Posted in: Briefs, Electronics & Computers
Read More >>

Overcoming RF Signal Generation Challenges with New DAC Technologies

This features our new AWG5200, with high signal fidelity and the ability to scale up to 32 or more channels with multi-unit synchronization, all at an affordable price.

Posted in: White Papers, White Papers, Aerospace, Electronics & Computers, RF & Microwave Electronics
Read More >>

Architectures for Implementing a Hardware-in-the-Loop System

Safety, availability, or cost considerations can make it impractical to perform all the necessary tests with the complete embedded control system. Using hardware-in-the-loop (HIL) simulation, you can simulate the parts of the system that pose these challenges. By thoroughly testing the embedded control device in a virtual environment before proceeding to real-world tests of the complete system, you can maintain reliability and time-to-market requirements in a cost-effective manner even as the systems you are testing become more complex. Download this whitepaper to find out more about implement a HIL system into your test environment.

Posted in: White Papers, Automotive, Electronics & Computers, Test & Measurement
Read More >>

A Modular Apparatus and Method for Attaching Multiple Devices

This technology improves the real-time monitoring of high-temperature or other harsh environments.

Posted in: Briefs, Electronics & Computers, Electronic equipment, Sensors and actuators, Fabrication, Silicon alloys, Protective structures
Read More >>

The U.S. Government does not endorse any commercial product, process, or activity identified on this web site.