Electrical/Electronics

Optimizing Performance with Technology Embedded Apparel

Intercomp USA’s latest e-book delves into the smart garment market and how sensors are crucial for making garments smart. More importantly, Intercomp reveals an exciting new technology called tailored fiber placement (TFP), available through its partnership with LayStitch. TFP promises to help with smart garment production and will enable aerospace, automotive and other equipment manufacturers to produce parts that are lighter, stronger and less expensive. Click here to download your FREE copy today or visit intercomp.com to learn more.

Posted in: White Papers

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When Wire Feedthroughs Make Sense

Engineers who work with pressure and vacuum chambers usually reach for off-the-shelf sealed bulkhead connectors when they need to pass power and signal wires through the chamber wall. And while these connectors may seem like the best or only way to breach the chamber walls, they can actually drive cost, impose unnecessary mechanical design constraints and trigger electrical problems. So what’s the alternative? Wire feedthroughs hermetically sealed with epoxy. Learn more in our white paper.

Posted in: White Papers

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Traceability Best Practices for Systems Engineers

Serious situations: In the middle of a project, your best customer changes a high-level business requirement. How will this change impact the system spec your engineers are working on right now? How will it impact scope for the upcoming release?

Posted in: White Papers, Electronics

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Nonlinear Model Predictive Control

This whitepaper presents an automatic workflow for implementing Model Predictive Control (MPC) controllers. The process uses MapleSim to generate a model of the system, whose dynamic equations are then extracted using Maple. Next, Maple is used to formulate the MPC problem, and generate the solver, which it automatically converts into the C code of the MPC controller. The advantage of using Maple is that the required procedures and their corresponding derivatives are computed and optimized whenever there is a change in the dynamic equations. The use of Maple saves time, removes human error, and produces highly optimized controller code.

Posted in: White Papers

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Three Phase Active Power Factor Correction in a Single Step

Isolated, Regulated DC Output in One Conversion Reduces Cost, Complexity and Risk Multi-step regulation and isolation of electronic circuits is a complex and costly process for AC to DC conversion in high power applications, demanding close attention to power factor and current distortion, as well as size, weight, efficiency and cost. To solve these challenges for the power conversion engineer, Marotta Controls has developed its new patent-pending 1-STEP AC-DC Conversion™.

Posted in: White Papers

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Finding the Right Manufacturer for Your Design

To receive a quality PCB, you need an efficient design and a manufacturer capable of producing it. This paper will examine the challenges and best practices associated with matching your design requirements to a manufacturer's capabilities.

Posted in: White Papers

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Electronic Component Testing: A Non-contact Sport

As electronic circuit boards and components get smaller and more powerful, inherent heat can cause significant damage. Infrared thermography can identify hot spots, allowing for improved thermal management and greater advances in circuit board design.

Posted in: White Papers, Electronics, Cameras

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